Invention Grant
US08314501B2 Semiconductor chip package structure, semiconductor chip and semiconductor chip group
有权
半导体芯片封装结构，半导体芯片和半导体芯片组
- Patent Title: Semiconductor chip package structure, semiconductor chip and semiconductor chip group
- Patent Title (中): 半导体芯片封装结构，半导体芯片和半导体芯片组
-
Application No.: US13026419Application Date: 2011-02-14
-
Publication No.: US08314501B2Publication Date: 2012-11-20
- Inventor: Ping-Chia Shih
- Applicant: Ping-Chia Shih
- Applicant Address: TW Hsinchu
- Assignee: United Microelectronics Corp.
- Current Assignee: United Microelectronics Corp.
- Current Assignee Address: TW Hsinchu
- Agent Ding Yu Tan
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/00 ; H01L23/488
Abstract:
A semiconductor chip package structure including a first semiconductor chip, a second semiconductor chip and a supporting substrate is provided. The first semiconductor chip includes at least a first conductor unit. The first conductor unit has a first bonding surface and a second bonding surface exposed from the first semiconductor chip. The second semiconductor chip includes at least a second conductor unit. The second conductor unit has a third bonding surface and a fourth bonding surface exposed from the second semiconductor chip. The third bonding surface is contacted with and electrically connected to the first bonding surface. The supporting substrate includes a wire unit for electrically connecting to at least one of the second bonding surface and the fourth bonding surface. A semiconductor chip and a semiconductor chip group are also provided.
Public/Granted literature
- US20120205794A1 SEMICONDUCTOR CHIP PACKAGE STRUCTURE AND SEMICONDUCTOR CHIP Public/Granted day:2012-08-16
Information query
IPC分类:
