Invention Grant
- Patent Title: Transfer device for receiving and transferring a solder ball arrangement
- Patent Title (中): 用于接收和传送焊球装置的传送装置
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Application No.: US12663329Application Date: 2008-04-17
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Publication No.: US08328068B2Publication Date: 2012-12-11
- Inventor: Ghassem Azdasht , Siavash Tabrizi
- Applicant: Ghassem Azdasht , Siavash Tabrizi
- Applicant Address: DE Nauen DE Nauen
- Assignee: Pac Tech—Packaging Technologies GmbH,Smart Pac GmbH Technology Services
- Current Assignee: Pac Tech—Packaging Technologies GmbH,Smart Pac GmbH Technology Services
- Current Assignee Address: DE Nauen DE Nauen
- Agency: Fredrikson & Byron, P.A.
- Priority: DE102007027291 20070611
- International Application: PCT/DE2008/000637 WO 20080417
- International Announcement: WO2008/151588 WO 20081218
- Main IPC: B23K3/06
- IPC: B23K3/06 ; B23K3/08
Abstract:
The present invention relates to a transfer device (10) for receiving and transferring a solder ball arrangement (28). Said transfer device comprises a discharge container (11) and a transfer substrate (12) that interacts with the discharge container in order to obtain a flat solder ball arrangement and that can be subjected to a negative pressure. The discharge container comprises an at least partially perforated base wall (14) and the transfer substrate has a hole pattern for receiving the solder ball arrangement. The discharge container comprises an ultrasound device (37) for subjecting said discharge container to ultrasound vibrations.
Public/Granted literature
- US20100213243A1 TRANSFER DEVICE FOR RECEIVING AND TRANSFERRING A SOLDER BALL ARRANGEMENT Public/Granted day:2010-08-26
Information query
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