公开(公告)号：US20210379683A1

公开(公告)日：2021-12-09

申请号：US16614235

申请日：2018-05-15

Applicant: Ghassem Azdasht

Inventor： Ghassem Azdasht

IPC: B23K3/06 ,  B23K1/005 ,  B23K1/00

Abstract: Assembly for placing solder from solder balls on a substrate, comprising a reservoir with a plurality of solder balls, an exit opening for releasing one single solder ball, a feeding channel between the reservoir and the exit opening with a feeding channel width larger than the diameter of one solder ball and smaller than the diameter of two solder balls, and a suction channel with end opening into the feeding channel which end is smaller than the diameter of one solder ball. A pressure difference is generated between the feeding channel and the suction channel and is controlled whereby pressure in the suction channel is smaller than in the feeding channel. A solder ball present in the feeding channel can be sucked to and held to the end of the suction channel at a first pressure difference to block feeding of solder balls and is released at a second pressure difference.

公开(公告)号：US08328068B2

公开(公告)日：2012-12-11

申请号：US12663329

申请日：2008-04-17

Applicant: Ghassem Azdasht ,  Siavash Tabrizi

Inventor： Ghassem Azdasht ,  Siavash Tabrizi

IPC: B23K3/06 ,  B23K3/08

CPC classification number: B23K1/06 ,  B23K3/0623 ,  H05K3/3478

Abstract: The present invention relates to a transfer device (10) for receiving and transferring a solder ball arrangement (28). Said transfer device comprises a discharge container (11) and a transfer substrate (12) that interacts with the discharge container in order to obtain a flat solder ball arrangement and that can be subjected to a negative pressure. The discharge container comprises an at least partially perforated base wall (14) and the transfer substrate has a hole pattern for receiving the solder ball arrangement. The discharge container comprises an ultrasound device (37) for subjecting said discharge container to ultrasound vibrations.

Abstract translation: 本发明涉及一种用于接收和转移焊球装置（28）的转移装置（10）。 所述转移装置包括与放电容器相互作用的放电容器（11）和转移衬底（12），以获得平坦的焊球布置并且可以承受负压。 放电容器包括至少部分穿孔的底壁（14），并且转印衬底具有用于接收焊球布置的孔图案。 放电容器包括用于对所述放电容器进行超声波振动的超声装置（37）。

公开(公告)号：US07882997B2

公开(公告)日：2011-02-08

申请号：US11572105

申请日：2005-07-11

Applicant: Elke Zakel ,  Ghassem Azdasht

Inventor： Elke Zakel ,  Ghassem Azdasht

IPC: B23K37/04

CPC classification number: H01L24/26 ,  H01L24/80 ,  H01L24/83 ,  H01L25/50 ,  H01L2224/83224 ,  H01L2224/83801 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/19043

Abstract: A method and a device for the mutual contacting of two wafer-type component composite configurations made of multiple identical components which are implemented coherently, in particular a semiconductor wafer (12) with a functional component wafer (14), to produce electronic assemblies on the wafer level, in which the component composite configurations are each situated on a receptacle unit (11; 13) and the contact pressure necessary for the contacting between contact metallizations of the component composite configurations to be connected to one another is generated in such a way that a vacuum is generated in a contact chamber which receives the component composite configurations and is delimited by the receptacle units, and the contacting of the contact metallizations is performed by a rear energy impingement of a component composite configuration.

Abstract translation: 一种用于相互接触的两个晶片型部件复合结构相互接触的方法和装置，所述两个晶片型部件复合结构由相干地实现的多个相同部件，特别是具有功能部件晶片（14）的半导体晶片（12）制成，以在其上产生电子组件 晶片级，其中部件复合结构各自位于插座单元（11; 13）上，并且以相互连接的部件复合结构的接触金属化之间的接触所需的接触压力被产生，使得 在接收室中产生真空，该接触室接收组件复合结构，并由容器单元限定，并且接触金属化的接触通过组件复合构造的后能量冲击来执行。

公开(公告)号：US20100213243A1

公开(公告)日：2010-08-26

申请号：US12663329

申请日：2008-04-17

Applicant: Ghassem Azdasht ,  Siavash Tabrizi

Inventor： Ghassem Azdasht ,  Siavash Tabrizi

IPC: B23K3/08 ,  B23K3/06

CPC classification number: B23K1/06 ,  B23K3/0623 ,  H05K3/3478

Abstract: The present invention relates to a transfer device (10) for receiving and transferring a solder ball arrangement (28). Said transfer device comprises a discharge container (11) and a transfer substrate (12) that interacts with the discharge container in order to obtain a flat solder ball arrangement and that can be subjected to a negative pressure. The discharge container comprises an at least partially perforated base wall (14) and the transfer substrate has a hole pattern for receiving the solder ball arrangement. The discharge container comprises an ultrasound device (37) for subjecting said discharge container to ultrasound vibrations.

Abstract translation: 本发明涉及一种用于接收和转移焊球装置（28）的转移装置（10）。 所述转移装置包括与放电容器相互作用的放电容器（11）和转移衬底（12），以获得平坦的焊球布置并且可以承受负压。 放电容器包括至少部分穿孔的底壁（14），并且转印衬底具有用于接收焊球布置的孔图案。 放电容器包括用于对所述放电容器进行超声波振动的超声装置（37）。

公开(公告)号：US20090249620A1

公开(公告)日：2009-10-08

申请号：US12414133

申请日：2009-03-30

Applicant: Ghassem Azdasht

Inventor： Ghassem Azdasht

IPC: H05K3/34 ,  H05K13/04 ,  B23P19/04

CPC classification number: H05K3/3494 ,  H01L24/75 ,  H05K3/303 ,  H05K3/3478 ,  H05K2203/0195 ,  H05K2203/041 ,  H05K2203/107 ,  Y10T29/49133 ,  Y10T29/49149 ,  Y10T29/49822 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53183 ,  Y10T29/53191 ,  Y10T29/53274

Abstract: The invention relates to a method for applying an electronic component (24), which is provided with terminal faces (34, 35), to a substrate (33), which is provided with terminal faces (31, 32), wherein the component is removed from a feeding device by means of an application device (27), the component is subsequently positioned on the substrate by means of the application device in such a manner that the component terminal faces extending from a contact side (37) of the component up to a component rear side (38) and the substrate terminal faces are in an overlapping position and the terminal faces are subsequently contacted by means of a direct application of laser energy to the component terminal faces.

Abstract translation: 本发明涉及一种将具有端子面（34,35）的电子部件（24）应用于设置有端子面（31,32）的基板（33）的方法，其中，所述部件为 通过施加装置（27）从进给装置移除，随后通过应用装置将部件定位在基板上，使得部件端子面从部件的接触侧（37）向上延伸 到元件后侧（38），并且基板端子面处于重叠位置，并且随后通过将激光能量直接施加到元件端子面来接触端子面。

公开(公告)号：US20070272991A1

公开(公告)日：2007-11-29

申请号：US10581819

申请日：2004-12-02

Applicant: Elke Zakel ,  Ghassem Azdasht

Inventor： Elke Zakel ,  Ghassem Azdasht

IPC: H01L21/00 ,  B23K1/00 ,  H01L29/66

CPC classification number: H01L23/10 ,  B23K26/57 ,  B23K35/262 ,  B23K35/3013 ,  B23K2101/40 ,  H01L21/50 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/16 ,  H01L2924/01079

Abstract: A method and device for alternately contacting two wafer-like component composite arrangements (12, 14) consisting of a plurality of cohesively designed similar components, in particular of a semiconductor wafer with a function component wafer for manufacturing electronic modules on a wafer level, in which the two component composite arrangements, each provided with contact metallizations on their opposing contact surfaces (38, 39), are brought into a coverage position with their contact metallizations to form contact pairs, in which position the contact metallizations that are to be joined together are pressed against one another, the contact metallizations being thereby contacted by exposing the rear of one of the component composite arrangements (12) to laser radiation (20), the wavelength of the laser radiation being selected as a function of the degree of absorption of the component composite arrangement exposed to laser radiation at the rear, so that a transmission of the laser radiation through the component composite arrangement exposed to the laser radiation at the rear is essentially suppressed or an absorption of the laser radiation takes place essentially in the contact metallizations of one or both component composite arrangements.

Abstract translation: 交替地接触由多个内聚设计的类似部件组成的两个晶片状部件复合布置（12,14）的方法和装置，特别是具有用于在晶片级上制造电子模块的功能元件晶片的半导体晶片， 其中每个在其相对的接触表面（38,39）上设置有接触金属化的双组分复合布置通过它们的接触金属化进入覆盖位置，以形成接触对，在该位置上将要接合在一起的接触金属化 因此，通过将组件复合装置（12）中的一个的后部暴露于激光辐射（20），接触金属化从而接触，激光辐射的波长被选择为吸收程度的函数 组件复合布置暴露在后面的激光辐射，使得传输 通过暴露于后方的激光辐射的组分复合布置的激光辐射基本上被抑制，或者激光辐射的吸收基本上在一个或两个组件复合布置的接触金属化中发生。

公开(公告)号：US06915940B2

公开(公告)日：2005-07-12

申请号：US10474450

申请日：2002-04-12

Applicant: Elke Zakel ,  Ghassem Azdasht

Inventor： Elke Zakel ,  Ghassem Azdasht

IPC: B23K3/06 ,  B23K101/42 ,  H05K3/34 ,  B23K1/00 ,  B23K5/00 ,  B23K20/14 ,  B23K37/00

CPC classification number: B23K3/0607 ,  B23K3/0623 ,  B23K2101/36 ,  H05K3/3478

Abstract: An apparatus for applying solder balls to a substrate and for remelting the solder balls on soldering points of the substrate has a capillary for supplying a solder ball to the soldering points and for placing the solder ball at the free end of the capillary opposite the soldering point, a means for supplying heat to the solder ball to remelt it, and a pressing apparatus for holding down the substrate to prevent the substrate from being resilient when placing and remelting the solder ball.

Abstract translation: 用于将焊球用于衬底并在衬底的焊接点上重新焊接焊球的设备具有毛细管，用于将焊球提供给焊接点，并将焊球放置在与焊接点相对的毛细管自由端处 用于向焊球供热以重新熔化的装置，以及用于按压衬底以防止衬底在放置和重熔焊球时具有弹性的按压装置。

公开(公告)号：US06281577B1

公开(公告)日：2001-08-28

申请号：US08847961

申请日：1997-04-22

Applicant: Hans-Hermann Oppermann ,  Elke Zakel ,  Ghassem Azdasht ,  Paul Kasulke

Inventor： Hans-Hermann Oppermann ,  Elke Zakel ,  Ghassem Azdasht ,  Paul Kasulke

IPC: H01L2334

CPC classification number: H01L25/0657 ,  H01L25/0652 ,  H01L2225/06517 ,  H01L2225/06551 ,  H01L2225/06555 ,  H01L2225/06575 ,  H01L2225/06579 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Process for the formation of a spatial chip arrangement having several chips (32, 36, 37, 38, 39) arranged in several planes and electrically connected to one another, in which the chips are connected via their peripheral connection surfaces (33) to assigned conducting paths (23) of a conducting-path structure (24, 25) arranged on at least one carrier substrate (21, 22) by the chips being arranged either transverse to the longitudinal extent of the carrier substrate or parallel to the longitudinal extent of the flexibly constructed carrier substrate, as well as a spatial chip arrangement that is formed by means of this process.

Abstract translation: 用于形成具有布置在多个平面中并彼此电连接的多个芯片（32,36,37,38,39）的空间芯片布置的工艺，其中芯片经由其外围连接表面（33）连接到分配 通过芯片布置在至少一个载体基板（21,22）上的导电通路结构（24,25）的导电路径（23）横向于载体基板的纵向延伸或平行于 灵活构造的载体衬底，以及通过该工艺形成的空间芯片布置。

公开(公告)号：US06180434B2

公开(公告)日：2001-01-30

申请号：US09284361

申请日：1999-04-13

Applicant: Martin Lange ,  Ghassem Azdasht

Inventor： Martin Lange ,  Ghassem Azdasht

IPC: H01L2144

CPC classification number: G06K19/0775 ,  G06K19/07749

Abstract: A method of producing a contactless chip card (10) includes first the step of holding a chip (14), which is provided with terminal pads (16a, 16b) on a surface thereof, in a mould defining a chip-card substrate (12), in such a way that the chip surface provided with the terminal pads is located substantially in the same plane as a chip-card substrate surface defined by the mould. In addition, a chip-card substrate material is introduced into the mould, whereupon a coil structure (18) is applied by screen-printing a conductive paste onto the chip-card substrate (12) in such a way that the coil structure (18) extends up to the terminal pads (16a, 16b) on the chip.

Abstract translation: 一种制造非接触式芯片卡（10）的方法首先包括在其表面上设置有端子焊盘（16a，16b）的芯片（14）保持在限定芯片卡基板（12）的模具中的步骤 ），使得设置有端子焊盘的芯片表面基本上位于与由模具限定的芯片卡基板表面相同的平面中。 此外，将芯片卡基材材料引入模具中，由此通过将导电浆料丝网印刷到芯片卡基材（12）上，使线圈结构（18）以线圈结构（18） ）延伸到芯片上的端子焊盘（16a，16b）。

公开(公告)号：US09401298B2

公开(公告)日：2016-07-26

申请号：US11910771

申请日：2006-04-10

Applicant: Elke Zakel ,  Ghassem Azdasht

Inventor： Elke Zakel ,  Ghassem Azdasht

IPC: H01L21/683 ,  H01L21/687 ,  H01L21/67 ,  H01L23/00

CPC classification number: H01L21/6835 ,  H01L21/67132 ,  H01L21/67144 ,  H01L21/6836 ,  H01L24/31 ,  H01L24/75 ,  H01L24/83 ,  H01L24/86 ,  H01L2221/68327 ,  H01L2221/68354 ,  H01L2224/16 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/75 ,  H01L2224/75263 ,  H01L2224/75314 ,  H01L2224/7565 ,  H01L2224/7965 ,  H01L2224/81005 ,  H01L2224/81224 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/83851 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/19043 ,  H01L2924/00014

Abstract: A method and device for transferring a chip (18) situated on a transfer substrate (26) to a contact substrate (50), and for contacting the chip with the contact substrate, in which the chip, the back side (19) of which is attached adhesively to a support surface of the transfer substrate facing the contact substrate, is charged with laser energy from behind through the transfer substrate, and the chip contacts (59, 60) thereof that are arranged opposite a contact surface (58) of the contact substrate are brought into contact with substrate contacts (56, 57) arranged on the contact surface by means of a pressing device (45, 46) from behind through the transfer substrate, and a thermal bond is created between the chip contacts and the substrate contacts.

Abstract translation: 一种用于将位于转印衬底（26）上的芯片（18）转移到接触衬底（50）并将芯片与接触衬底接触的方法和装置，其中芯片的背面（19） 被粘附到转移基板的面向接触基板的支撑表面上，从后面通过转印基板充满激光能量，并且其与芯片接触（59,60）相对地设置在与基板的接触表面（58）相对的位置 接触基板通过从后面通过转印基板的加压装置（45,46）与布置在接触表面上的基板触点（56,57）接触，并且在芯片触头和基板之间产生热粘合 联系人