Invention Grant
- Patent Title: Advanced process control for gate profile control
- Patent Title (中): 门型材控制的先进过程控制
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Application No.: US12402124Application Date: 2009-03-11
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Publication No.: US08352062B2Publication Date: 2013-01-08
- Inventor: Chih-Jen Wu , Chen-Ming Huang , An-Chun Tu
- Applicant: Chih-Jen Wu , Chen-Ming Huang , An-Chun Tu
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: G06F19/00
- IPC: G06F19/00

Abstract:
A method for fabricating a integrated circuit with improved performance is disclosed. The method comprises providing a substrate; performing a plurality of processes to form a gate stack over the substrate, wherein the gate stack comprises a gate layer; measuring a grain size of the gate layer after at least one of the plurality of processes; determining whether the measured grain size is within a target range; and modifying a recipe of at least one of the plurality of processes if the measured grain size of the gate layer is not within the target range.
Public/Granted literature
- US20100234975A1 ADVANCED PROCESS CONTROL FOR GATE PROFILE CONTROL Public/Granted day:2010-09-16
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