Invention Grant
- Patent Title: Display panel package structure and fabricating method thereof
- Patent Title (中): 显示面板封装结构及其制造方法
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Application No.: US12871029Application Date: 2010-08-30
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Publication No.: US08358065B2Publication Date: 2013-01-22
- Inventor: Chih-Che Liu , Shih-Feng Hsu
- Applicant: Chih-Che Liu , Shih-Feng Hsu
- Applicant Address: TW Hsin-Chu
- Assignee: Au Optronics Corporation
- Current Assignee: Au Optronics Corporation
- Current Assignee Address: TW Hsin-Chu
- Agency: McClure, Qualey & Rodack, LLP
- Priority: TW99109942A 20100331
- Main IPC: H01J1/62
- IPC: H01J1/62 ; H01J63/04
Abstract:
A display panel package structure is disclosed, which includes a first substrate, a metal wire layer formed on the first substrate, an insulating layer formed on the metal wire layer, a second substrate, a frit formed on an edge of the second substrate for sealing the first substrate and the second substrate, and a conductive layer formed between the frit and the insulating layer corresponding to the frit for conducting a heat when the frit is heated.
Public/Granted literature
- US20110241541A1 Display Panel Package Structure and Fabricating Method Thereof Public/Granted day:2011-10-06
Information query
