Invention Grant
US08359555B2 Arranging virtual patterns in semiconductor layout 有权
在半导体布局中排列虚拟图案

  • Patent Title: Arranging virtual patterns in semiconductor layout
  • Patent Title (中): 在半导体布局中排列虚拟图案
  • Application No.: US12868694
    Application Date: 2010-08-25
  • Publication No.: US08359555B2
    Publication Date: 2013-01-22
  • Inventor: Yan-Liang Ji
  • Applicant: Yan-Liang Ji
  • Applicant Address: TW Science-Based Industrial Park, Hsin-Chu
  • Assignee: United Microelectronics Corp.
  • Current Assignee: United Microelectronics Corp.
  • Current Assignee Address: TW Science-Based Industrial Park, Hsin-Chu
  • Agent Winston Hsu; Scott Margo
  • Main IPC: G06F17/50
  • IPC: G06F17/50
Arranging virtual patterns in semiconductor layout
Abstract:
A computer readable medium comprising multiple instructions stored in a computer readable device, upon executing these instructions, a computer performing the following steps: providing a first semiconductor layout and a second semiconductor layout predetermined to be fabricated on different material layers of a semiconductor device, the second semiconductor layout comprising a circuit pattern; setting a forbidden area of the circuit pattern on the first semiconductor layout according to a restriction condition; defining at least a virtual pattern arrangement area on a portion of the first semiconductor layout which does not correspond to the forbidden area; and selecting a positioning point at a boundary of the virtual pattern arrangement area and providing a virtual pattern array in the virtual pattern arrangement by taking the positioning point as an origin of a coordinate system of the virtual pattern array.
Information query
Patent Agency Ranking
0/0