Invention Grant
- Patent Title: Micro-fluidic injection molded solder (IMS)
- Patent Title (中): 微流体注射焊料(IMS)
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Application No.: US13367466Application Date: 2012-02-07
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Publication No.: US08376207B2Publication Date: 2013-02-19
- Inventor: Stephen L. Buchwalter , Peter A. Gruber , Paul A. Lauro , Jae-Woong Nah
- Applicant: Stephen L. Buchwalter , Peter A. Gruber , Paul A. Lauro , Jae-Woong Nah
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Ryan, Mason & Lewis, LLP
- Agent Daniel P. Morris
- Main IPC: B23K5/00
- IPC: B23K5/00 ; B23K20/08 ; B22D41/00

Abstract:
A portion of compliant material includes four walls defining a slot. The slot has a relatively large cross-section end in fluid communication with a solder reservoir, and also has a relatively small cross-section end opposed to the relatively large cross-section end. The slot has a generally elongate rectangular shape when viewed in plan, with a length perpendicular to a scan direction, a width, parallel to the scan direction, associated with the relatively large cross section end, and a width, parallel to the scan direction, associated with the relatively small cross section end. The slot is configured in the portion of compliant material such that the relatively small cross-section end of the slot normally remains substantially closed, but locally opens sufficiently to dispense solder from the reservoir when under fluid pressure and locally unsupported by a workpiece. Methods of operation and fabrication are also disclosed.
Public/Granted literature
- US20120132694A1 Micro-Fluidic Injection Molded Solder (IMS) Public/Granted day:2012-05-31
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