Invention Grant
- Patent Title: Semiconductor chip with a rounded corner
- Patent Title (中): 半导体芯片带圆角
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Application No.: US12728423Application Date: 2010-03-22
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Publication No.: US08378458B2Publication Date: 2013-02-19
- Inventor: Seah S. Too , Edward Alcid
- Applicant: Seah S. Too , Edward Alcid
- Applicant Address: US CA Sunnyvale
- Assignee: Advanced Micro Devices, Inc.
- Current Assignee: Advanced Micro Devices, Inc.
- Current Assignee Address: US CA Sunnyvale
- Agent Timothy M. Honeycutt
- Main IPC: H01L21/50
- IPC: H01L21/50
Abstract:
Various semiconductor chips and methods of making the same are disclosed. In one aspect, a method of manufacturing is provided that includes providing a semiconductor wafer that has plural semiconductor chips. Each of the plural semiconductor chips includes a first principal side and a second and opposite principal side. Material is removed from the semiconductor wafer to define at least one rounded corner of the first principal side of at least one of the plural semiconductor chips.
Public/Granted literature
- US20110227201A1 SEMICONDUCTOR CHIP WITH A ROUNDED CORNER Public/Granted day:2011-09-22
Information query
IPC分类:
