Invention Grant
- Patent Title: Method for producing layout of semiconductor integrated circuit with radio frequency devices
- Patent Title (中): 用射频设备制造半导体集成电路布局的方法
-
Application No.: US12945122Application Date: 2010-11-12
-
Publication No.: US08386976B2Publication Date: 2013-02-26
- Inventor: Tsun-Lai Hsu , Jui-Fang Chen , Jun-Hong Ou , Ji-Wei Hsu
- Applicant: Tsun-Lai Hsu , Jui-Fang Chen , Jun-Hong Ou , Ji-Wei Hsu
- Applicant Address: TW Hsinchu
- Assignee: United Microelectronics Corp.
- Current Assignee: United Microelectronics Corp.
- Current Assignee Address: TW Hsinchu
- Agency: J.C. Patents
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
A method for producing a layout of a device in an integrated circuit before actually fabricated is provided. The method includes inputting at least one fixed parameter for the device for fabrication. And then, a first part of a set of variable parameters of a layout of the device is input. The complete set of the variable parameters is generated. It is checked whether or not the layout with the parameters is satisfying a requirement, wherein an end step is reached if the layout is accepted by the requirement, and a new part of the set of variable parameters as the first part being looping in the foregoing steps if the layout is not accepted by the requirement.
Public/Granted literature
- US20110061031A1 METHOD FOR PRODUCING LAYOUT OF SEMICONDUCTOR INTEGRATED CIRCUIT WITH RADIO FREQUENCY DEVICES Public/Granted day:2011-03-10
Information query