Invention Grant
- Patent Title: Substrate structures applied in flexible electrical devices and fabrication method thereof
- Patent Title (中): 柔性电气装置中应用的基板结构及其制造方法
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Application No.: US13449036Application Date: 2012-04-17
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Publication No.: US08388779B2Publication Date: 2013-03-05
- Inventor: Hsueh-Yi Liao , Chyi-Ming Leu , Chun-Wei Su
- Applicant: Hsueh-Yi Liao , Chyi-Ming Leu , Chun-Wei Su
- Applicant Address: TW
- Assignee: Industrial Technology Research Institute
- Current Assignee: Industrial Technology Research Institute
- Current Assignee Address: TW
- Agency: Lowe Hauptman Ham & Berner, LLP
- Priority: TW97135351A 20080915
- Main IPC: B05D1/36
- IPC: B05D1/36 ; B05D3/12
Abstract:
A substrate structure applied in flexible electrical devices is provided. The substrate structure includes a carrier, a release layer overlying the carrier with a first area and a flexible substrate overlying the release layer and the carrier with a second area, wherein the second area is larger than the first area and the flexible substrate has a greater adhesion force than that of the release layer to the carrier. The disclosure also provides a method for fabricating the substrate structure.
Public/Granted literature
- US20120201961A1 SUBSTRATE STRUCTURES APPLIED IN FLEXIBLE ELECTRICAL DEVICES AND FABRICATION METHOD THEREOF Public/Granted day:2012-08-09
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