Invention Grant
- Patent Title: Arrangement with a semiconductor chip and an optical waveguide layer
- Patent Title (中): 与半导体芯片和光波导层的布置
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Application No.: US12528960Application Date: 2008-01-23
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Publication No.: US08393748B2Publication Date: 2013-03-12
- Inventor: Siegfried Herrmann , Berthold Hahn , Joerg Sorg , Stefan Gruber
- Applicant: Siegfried Herrmann , Berthold Hahn , Joerg Sorg , Stefan Gruber
- Applicant Address: DE Regensburg
- Assignee: OSRAM Opto Semiconductors GmbH
- Current Assignee: OSRAM Opto Semiconductors GmbH
- Current Assignee Address: DE Regensburg
- Agency: Slater & Matsil, L.L.P.
- Priority: DE102007010755 20070306
- International Application: PCT/DE2008/000124 WO 20080123
- International Announcement: WO2008/106915 WO 20080912
- Main IPC: F21V33/00
- IPC: F21V33/00

Abstract:
An arrangement includes a semiconductor chip, which is designed to emit light during operation, and a cover layer, which lies across from the light-emitting surface of the semiconductor chip, such that light emitted from the semiconductor chip penetrates into the cover layer. In an area of the cover layer, overlapping with the chip, a light deflecting structure is provided by means of which light penetrating into the cover layer is deflected. The cover layer acts as an optical waveguide and is designed to emit the light such that it is distributed over the upper surface of cover layer.
Public/Granted literature
- US20100103650A1 Arrangement With a Semiconductor Chip and an Optical Waveguide Layer Public/Granted day:2010-04-29
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