公开(公告)号：US20110266571A1

公开(公告)日：2011-11-03

申请号：US12995181

申请日：2009-04-20

Applicant: Thomas Zeiler ,  Reiner Windisch ,  Stefan Gruber ,  Markus Kirsch ,  Julius Muschaweck ,  Torsten Baade ,  Herbert Brunner ,  Steffen Köhler

Inventor： Thomas Zeiler ,  Reiner Windisch ,  Stefan Gruber ,  Markus Kirsch ,  Julius Muschaweck ,  Torsten Baade ,  Herbert Brunner ,  Steffen Köhler

IPC: H01L33/58 ,  H01L31/0232

CPC classification number: H01L33/54 ,  H01L25/042 ,  H01L25/0753 ,  H01L33/38 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2924/00

Abstract: According to at least one embodiment of the semiconductor arrangement, the latter comprises a mounting side, at least one optoelectronic semiconductor chip with mutually opposing chip top and bottom, and at least one at least partially radiation-transmissive body with a body bottom, on which the semiconductor chip is mounted such that the chip top faces the body bottom. Moreover, the semiconductor arrangement comprises at least two electrical connection points for electrical contacting of the optoelectronic semiconductor chip, wherein the connection points do not project laterally beyond the body and with their side remote from the semiconductor chip delimit the semiconductor arrangement on the mounting side thereof.

Abstract translation: 根据半导体布置的至少一个实施例，后者包括安装侧，至少一个具有相对的芯片顶部和底部的光电子半导体芯片以及至少一个具有主体底部的至少部分辐射透射主体， 安装半导体芯片使得芯片顶部面向主体底部。 此外，半导体装置包括用于光电子半导体芯片的电接触的至少两个电连接点，其中连接点不侧向突出超过本体并且其远离半导体芯片的一侧限定其安装侧上的半导体布置 。

公开(公告)号：US20110057218A1

公开(公告)日：2011-03-10

申请号：US12680674

申请日：2008-09-12

Applicant: Jörg Sorg ,  Stefan Gruber

Inventor： Jörg Sorg ,  Stefan Gruber

IPC: H01L33/58 ,  H01L33/00

CPC classification number: H01L33/486 ,  H01L21/00 ,  H01L27/00 ,  H01L29/00 ,  H01L33/505 ,  H01L33/58 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A semiconductor based component with radiation-emitting properties. A glass substrate (1) is provided, which has a first surface (2) and a second surface (1), where a semiconductor element (5) with radiation-emitting properties is accommodated on the first surface (2). Also disclosed is a method for fabricating a semiconductor based component, with the following steps: providing a glass substrate (1), application of a semiconductor element (5) to the first surface (2) of the glass substrate. Also disclosed is a receptacle for a semiconductor based component in which two electrical contact areas (13) are provided, which can be electrically connected to contact areas (7) of the semiconductor based component.

Abstract translation: 具有辐射发射特性的基于半导体的部件。 提供了具有第一表面（2）和第二表面（1）的玻璃基板（1），其中具有辐射发射特性的半导体元件（5）容纳在第一表面（2）上。 还公开了一种制造基于半导体的部件的方法，其步骤如下：提供玻璃基板（1），向玻璃基板的第一表面（2）施加半导体元件（5）。 还公开了一种用于半导体基部件的插座，其中设置有两个电接触区域（13），其可以电连接到基于半导体的部件的接触区域（7）。

公开(公告)号：US20100270578A1

公开(公告)日：2010-10-28

申请号：US12742064

申请日：2008-12-09

Applicant: Joerg Erich Sorg ,  Stefan Gruber ,  Georg Bogner

Inventor： Joerg Erich Sorg ,  Stefan Gruber ,  Georg Bogner

IPC: H01L33/62 ,  H01L33/00

CPC classification number: H01L25/167 ,  H01L23/60 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

Abstract: A light emitting diode chip includes a device for protection against overvoltages, e.g., an ESD protection device. The ESD protection device is integrated into a carrier, on which the semiconductor layer sequence of the light emitting diode chip is situated, and is based on a specific doping of specific regions of said carrier. By way of example, the ESD protection device is embodied as a Zener diode that is connected to the semiconductor layer sequence by means of an electrical conductor structure.

Abstract translation: 发光二极管芯片包括用于防止过电压的装置，例如ESD保护装置。 ESD保护器件集成在发光二极管芯片的半导体层序列所在的载体上，并且基于对所述载体的特定区域的特定掺杂。 作为示例，ESD保护装置被实施为通过电导体结构连接到半导体层序列的齐纳二极管。

公开(公告)号：US20080283322A1

公开(公告)日：2008-11-20

申请号：US11951814

申请日：2007-12-06

Applicant: Stefan GRUBER ,  Christian BERGER ,  Norbert KORENJAK ,  Wolfgang SCHRENK ,  Thomas WEINZIERL ,  Johann WICKENHAUSER

Inventor： Stefan GRUBER ,  Christian BERGER ,  Norbert KORENJAK ,  Wolfgang SCHRENK ,  Thomas WEINZIERL ,  Johann WICKENHAUSER

IPC: B62K11/00 ,  F16H55/36

CPC classification number: F16H55/14 ,  F16H55/36 ,  F16H2055/366

Abstract: A power transmission wheel having a hub and a rim is disclosed. The hub has a central annular portion for operatively engaging a power transmitting shaft. The rim has an inner annular portion and an outer annular portion for operatively engaging a flexible power transmitting element. The central annular portion is disposed inside the inner annular portion with a rolling-element bearing therebetween. At least one hub blade is disposed radially between the inner and outer annular portions. At least one rim blade extends radially from one of the inner and outer annular portions towards the other of the inner and outer annular portions. The power transmission wheel has at least two elastomeric dampers. Each damper is interposed between one of the at least one hub blade and one of the at least one rim blade. An engine and vehicles using the power transmission wheels are also disclosed.

Abstract translation: 公开了一种具有轮毂和轮辋的动力传动轮。 轮毂具有用于可操作地接合动力传递轴的中心环形部分。 轮辋具有内环形部分和用于可操作地接合柔性动力传递元件的外环形部分。 中心环形部分设置在内环形部分内部，其间具有滚动元件轴承。 至少一个轮毂叶片径向设置在内环形部分和外环形部分之间。 至少一个边缘刀片从内环形部分和外环形部分中的一个径向延伸到内外环形部分中的另一个。 动力传动轮具有至少两个弹性阻尼器。 每个阻尼器插入在至少一个轮毂叶片中的一个与至少一个轮辋刀片中的一个之间。 还公开了使用动力传递轮的发动机和车辆。

公开(公告)号：US5965843A

公开(公告)日：1999-10-12

申请号：US911508

申请日：1997-08-14

Applicant: Eduard Schonberger ,  Stefan Gruber ,  Hermann Kasowski ,  Heinz Schmidt

Inventor： Eduard Schonberger ,  Stefan Gruber ,  Hermann Kasowski ,  Heinz Schmidt

IPC: H05K1/05 ,  H05K1/00 ,  H05K1/02 ,  H05K7/02 ,  H05K7/06 ,  H05K9/00

CPC classification number: H05K1/0256 ,  H05K1/0254 ,  H05K1/0278 ,  H05K1/028 ,  H05K9/0024 ,  H05K1/0218 ,  H05K1/0284 ,  H05K1/053 ,  H05K2201/0191 ,  H05K2201/0715 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2201/09281 ,  Y10S174/34

Abstract: An injection-molded part (1) includes elevations (2) and/or depressions (12) arranged between integrated printed conductors (4). If the elevations (2) or depressions (12) are uncoated and thus electrically insulating, they increase the effective voltage clearances between the printed conductors (4) and the components (3) arranged next to the printed conductors (4). The geometric distances can then be reduced. Alternatively, by electroconductively coating the elevations (2), electric and magnetic shielding is achieved in a simple manner. A cover (6) is provided as a top of a box which uses elevations (2) as side walls. A tapering portion (5) connects coatings (7,7') of the cover (6) and elevations (2) via a printed conductor (8) running diagonally across the tapering portion (5).

Abstract translation: 注塑部件（1）包括布置在集成印刷导体（4）之间的凸起（2）和/或凹陷（12）。 如果高度（2）或凹陷（12）未涂覆并因此电绝缘，则它们增加印刷导体（4）和布置在印刷导体（4）旁边的部件（3）之间的有效电压间隙。 然后可以减小几何距离。 或者，通过电导涂敷高度（2），以简单的方式实现电磁屏蔽。 盖（6）被设置为使用高度（2）作为侧壁的盒的顶部。 锥形部分（5）通过横向跨越锥形部分（5）运行的印刷导体（8）连接盖（6）的涂层（7,7'）和凸起（2）。

公开(公告)号：US09054279B2

公开(公告)日：2015-06-09

申请号：US12521352

申请日：2008-01-09

Applicant: Georg Bogner ,  Stefan Gruber ,  Thomas Zeiler ,  Markus Kirsch

Inventor： Georg Bogner ,  Stefan Gruber ,  Thomas Zeiler ,  Markus Kirsch

IPC: G02B6/00 ,  G02B6/14 ,  H01L33/48 ,  H01L25/16 ,  H01L25/075 ,  H01L33/60

CPC classification number: H01L33/483 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/73265 ,  H01L2924/00014

Abstract: A plastic housing is arranged on a carrier element and is provided with a recess in which an optoelectronic component is arranged. On the side facing away from the carrier element, the recess has an opening to the outside which can be provided with a transparent cover. One or more structures can be provided on the plastic housing in order to orient the cover and/or optical components relative to the optoelectronic component.

Abstract translation: 塑料外壳设置在载体元件上，并设置有凹部，光电元件布置在该凹部中。 在背离载体元件的一侧上，该凹部具有可以设置有透明盖的外部开口。 可以在塑料壳体上提供一个或多个结构，以便相对于光电子部件定向盖和/或光学部件。

公开(公告)号：US08796115B2

公开(公告)日：2014-08-05

申请号：US13440472

申请日：2012-04-05

Applicant: Jörg Erich Sorg ,  Stefan Gruber ,  Siegfried Herrmann ,  Berthold Hahn

Inventor： Jörg Erich Sorg ,  Stefan Gruber ,  Siegfried Herrmann ,  Berthold Hahn

IPC: H01L21/00 ,  H01L23/00 ,  H01L25/075 ,  H01L33/50 ,  H01L33/00 ,  H01L33/62

CPC classification number: H01L25/0753 ,  H01L24/24 ,  H01L24/82 ,  H01L33/0079 ,  H01L33/508 ,  H01L33/62 ,  H01L2224/24226 ,  H01L2224/24998 ,  H01L2224/48091 ,  H01L2224/76155 ,  H01L2224/82039 ,  H01L2224/82102 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01047 ,  H01L2924/01058 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01105 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A light-emitting diode arrangement comprising a plurality of semiconductor chips which are provided for emitting electromagnetic radiation from their front side and which are fixed by their rear side—opposite the front side—on a first main face of a common carrier body, wherein the semiconductor chips consist of a respective substrateless semiconductor layer stack and are fixed to the common carrier body without an auxiliary carrier, and to a method for producing such a light-emitting diode arrangement.

Abstract translation: 一种发光二极管装置，包括多个半导体芯片，所述多个半导体芯片被设置用于从其前侧发射电磁辐射并且通过它们的正面侧的后侧固定在公共载体主体的第一主面上，其中， 半导体芯片由相应的无基板的半导体层堆叠构成，并且在没有辅助载体的情况下固定到公共载体主体，以及制造这种发光二极管装置的方法。

公开(公告)号：US20130207139A1

公开(公告)日：2013-08-15

申请号：US13811846

申请日：2011-07-15

Applicant: Karl Weidner ,  Johann Ramchen ,  Axel Kaltenbacher ,  Walter Wegleiter ,  Bernd Barchmann ,  Stefan Gruber ,  Georg Bogner

Inventor： Karl Weidner ,  Johann Ramchen ,  Axel Kaltenbacher ,  Walter Wegleiter ,  Bernd Barchmann ,  Stefan Gruber ,  Georg Bogner

IPC: H01L33/60

CPC classification number: H01L33/60 ,  G02F1/133603 ,  H01L25/0753 ,  H01L25/0756 ,  H01L33/20 ,  H01L33/38 ,  H01L33/405 ,  H01L33/46 ,  H01L33/58 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A radiation-emitting component includes a semiconductor chip which has a first main surface, a second main surface on an opposite side from the first main surface and an active region that generates radiation; a carrier on which the semiconductor chip is fixed on the side of the second main surface; an output layer arranged on the first main surface of the semiconductor chip and forming a lateral output surface spaced apart from the semiconductor chip in a lateral direction, a recess tapering in a direction of the semiconductor chip being, formed in the output layer and deflecting radiation emerging from the first main surface during operation into the direction of the lateral output surface.

Abstract translation: 辐射发射部件包括半导体芯片，其具有第一主表面，与第一主表面相对的第二主表面和产生辐射的有源区域; 半导体芯片固定在第二主表面侧的载体; 输出层，布置在半导体芯片的第一主表面上，并在横向上形成与半导体芯片间隔开的横向输出表面，在输出层中形成在半导体芯片的方向上渐缩的凹部和偏转辐射 在运行过程中从第一主表面向侧向输出表面的方向出现。

公开(公告)号：US08393748B2

公开(公告)日：2013-03-12

申请号：US12528960

申请日：2008-01-23

Applicant: Siegfried Herrmann ,  Berthold Hahn ,  Joerg Sorg ,  Stefan Gruber

Inventor： Siegfried Herrmann ,  Berthold Hahn ,  Joerg Sorg ,  Stefan Gruber

IPC: F21V33/00

CPC classification number: G02B6/0055 ,  G02B6/0018 ,  G02B6/0051 ,  G02B6/0073 ,  G02B6/0076

Abstract: An arrangement includes a semiconductor chip, which is designed to emit light during operation, and a cover layer, which lies across from the light-emitting surface of the semiconductor chip, such that light emitted from the semiconductor chip penetrates into the cover layer. In an area of the cover layer, overlapping with the chip, a light deflecting structure is provided by means of which light penetrating into the cover layer is deflected. The cover layer acts as an optical waveguide and is designed to emit the light such that it is distributed over the upper surface of cover layer.

Abstract translation: 一种装置，其包括：半导体芯片，其被设计为在操作期间发光;以及覆盖层，其覆盖半导体芯片的发光表面，使得从半导体芯片发射的光穿透到覆盖层。 在覆盖层的与芯片重叠的区域中，提供光偏转结构，通过该偏转结构，穿透到覆盖层中的光被偏转。 覆盖层用作光波导，并被设计成发射光，使得其分布在覆盖层的上表面上。

公开(公告)号：US08331746B2

公开(公告)日：2012-12-11

申请号：US11992975

申请日：2006-09-22

Applicant: Georg Bogner ,  Herbert Brunner ,  Stefan Gruber

Inventor： Georg Bogner ,  Herbert Brunner ,  Stefan Gruber

IPC: G02B6/26

CPC classification number: G02B6/0018 ,  G02B6/002 ,  G02B6/0028 ,  G02B6/0065 ,  G02B6/0073 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

Abstract: An illumination unit comprising a luminescence diode chip mounted on a chip carrier and comprising an optical waveguide is specified. The optical waveguide is joined together from at least two separate parts, wherein the luminescence diode chip is encapsulated by one of the parts of the optical waveguide. A method for producing a luminescence diode chip of this type and also an LCD display comprising an illumination unit of this type are furthermore specified.

Abstract translation: 规定了包括安装在芯片载体上并包括光波导的发光二极管芯片的照明单元。 光波导从至少两个分离的部分连接在一起，其中发光二极管芯片由光波导的一个部分封装。 此外，还规定了这种类型的发光二极管芯片的制造方法以及包括这种照明单元的LCD显示器。