Invention Grant
- Patent Title: Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument
- Patent Title (中): 电子元件，半导体器件，制造方法，电路板和电子仪器
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Application No.: US12983733Application Date: 2011-01-03
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Publication No.: US08399999B2Publication Date: 2013-03-19
- Inventor: Nobuaki Hashimoto
- Applicant: Nobuaki Hashimoto
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JP9-19915 19970117
- Main IPC: H01L23/495
- IPC: H01L23/495
Abstract:
An electronic component including an electronic element, an electrode that is formed on a first surface of the electronic element, a first resin layer that is formed over the first surface of the electronic element, a wiring that is electrically connected to the electrode, a first portion of the wiring extending over the first resin layer, a second resin layer that is formed over the first resin layer and the wiring, the second resin layer having an opening, the opening overlapping the first portion of the wiring, an external terminal that is provided above the second resin layer, the external terminal being connected to the first portion of the wiring via the opening, and a third resin layer that is formed over the second resin layer, the third resin layer being provided around the external terminal.
Public/Granted literature
Information query
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