Invention Grant
- Patent Title: Method of fabricating high voltage device
- Patent Title (中): 制造高压器件的方法
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Application No.: US11853499Application Date: 2007-09-11
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Publication No.: US08420488B2Publication Date: 2013-04-16
- Inventor: Yun-Han Ma , Ming-Tsung Lee , Shih-Ming Liang , Hwi-Huang Chen
- Applicant: Yun-Han Ma , Ming-Tsung Lee , Shih-Ming Liang , Hwi-Huang Chen
- Applicant Address: TW Hsinchu
- Assignee: United Microelectronics Corp.
- Current Assignee: United Microelectronics Corp.
- Current Assignee Address: TW Hsinchu
- Agency: WPAT PC
- Agent Justin King
- Main IPC: H01L21/336
- IPC: H01L21/336

Abstract:
A high voltage device is provided. The high voltage device includes a gate on a substrate, two source/drain regions in the substrate beside the gate, and a composite gate dielectric layer that includes at least two stacked continuous layers, extending from one side to another side of the gate. Wherein, the at least two stacked continuous layers is a combination of at least one thermal oxide layer and at least one chemical vapor deposited layer.
Public/Granted literature
- US20090065879A1 HIGH VOLTAGE DEVICE AND METHOD OF FABRICATING THE SAME Public/Granted day:2009-03-12
Information query
IPC分类: