Invention Grant
- Patent Title: Substrate treatment equipment and manufacturing method of substrate
- Patent Title (中): 基板处理设备及其制造方法
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Application No.: US12659409Application Date: 2010-03-08
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Publication No.: US08424485B2Publication Date: 2013-04-23
- Inventor: Makoto Hirano , Akihiro Yoshida
- Applicant: Makoto Hirano , Akihiro Yoshida
- Applicant Address: JP Tokyo
- Assignee: Hitachi Kokusai Electric Inc.
- Current Assignee: Hitachi Kokusai Electric Inc.
- Current Assignee Address: JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JP2003-333664 20030925
- Main IPC: C23C16/52
- IPC: C23C16/52 ; B05C11/00

Abstract:
The invention aims to provide substrate treatment equipment that can automatically collect a substrate in a normal condition without needing manual operation. The equipment includes a substrate holder 26 for holding substrates 12 in a multistage manner and a substrate transfer unit 34 for transferring the substrates 12 into the substrate holder 26, wherein a substrate holding condition of the substrate holder 26 is sensed by a sensing section 60. The sensing section 60 has photo-sensors 64a, 64b, and sensing waveforms sensed by the photo-sensors 64a, 64b are compared with a normal waveform. A control section 66 is provided, which controls a substrate transfer unit 34 such that substrates 12 other than at least a substrate 12 that was determined to be abnormal are transferred by the unit.
Public/Granted literature
- US20100170436A1 Substrate treatment equipment and manufacturing method of substrate Public/Granted day:2010-07-08
Information query
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