Invention Grant
- Patent Title: Solder in cavity interconnection technology
- Patent Title (中): 焊接在腔互连技术中
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Application No.: US12643084Application Date: 2009-12-21
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Publication No.: US08424748B2Publication Date: 2013-04-23
- Inventor: Chuan Hu
- Applicant: Chuan Hu
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Winkle, PLLC
- Main IPC: H01L21/44
- IPC: H01L21/44 ; B23K31/02
Abstract:
An interconnection technology may use molded solder to define solder balls. A mask layer may be patterned to form cavities and solder paste deposited in the cavities. Upon heating, solder balls are formed. The cavity is defined by spaced walls to keep the solder ball from bridging during a bonding process. In some embodiments, the solder bumps connected to the solder balls may have facing surfaces which are larger than the facing surfaces of the solder ball.
Public/Granted literature
- US20110147440A1 Solder in Cavity Interconnection Technology Public/Granted day:2011-06-23
Information query
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