Invention Grant
- Patent Title: Polishing slurry and polishing material using same
- Patent Title (中): 抛光浆料和抛光材料使用相同
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Application No.: US11918226Application Date: 2006-04-14
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Publication No.: US08460414B2Publication Date: 2013-06-11
- Inventor: Akinori Etoh , Setsuko Oike , Tomokazu Ishizuka , Shigeharu Fujii , Kiyotaka Shindo
- Applicant: Akinori Etoh , Setsuko Oike , Tomokazu Ishizuka , Shigeharu Fujii , Kiyotaka Shindo
- Applicant Address: JP Minato-Ku, Tokyo
- Assignee: Mitsui Chemicals, Inc.
- Current Assignee: Mitsui Chemicals, Inc.
- Current Assignee Address: JP Minato-Ku, Tokyo
- Agency: Buchanan Ingersoll & Rooney PC
- Priority: JP2005-116475 20050414; JP2006-057117 20060303
- International Application: PCT/JP2006/307907 WO 20060414
- International Announcement: WO2006/112377 WO 20061026
- Main IPC: B24D3/28
- IPC: B24D3/28 ; B24D3/344 ; C09G1/16 ; D21H17/375 ; A61K47/48176
Abstract:
Disclosed is a polishing slurry which enables to suppress damages to an under layer while securing an adequate polishing rate. The polishing slurry contains a resin (A) having an amide group and an organic resin (B).
Public/Granted literature
- US20090064597A1 Polishing Slurry and Polishing Material Using Same Public/Granted day:2009-03-12
Information query
