Invention Grant
US08470184B2 Method for making a cavity in the thickness of a substrate which may form a site for receiving a component
有权
用于制造可形成用于接收部件的部位的基板的厚度的空腔的方法
- Patent Title: Method for making a cavity in the thickness of a substrate which may form a site for receiving a component
- Patent Title (中): 用于制造可形成用于接收部件的部位的基板的厚度的空腔的方法
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Application No.: US13264170Application Date: 2010-04-20
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Publication No.: US08470184B2Publication Date: 2013-06-25
- Inventor: Damien Saint-Patrice , Sebastien Bolis , Fabrice Jacquet
- Applicant: Damien Saint-Patrice , Sebastien Bolis , Fabrice Jacquet
- Applicant Address: FR Paris
- Assignee: Commissariat a l'energie atomique et aux energies alternatives
- Current Assignee: Commissariat a l'energie atomique et aux energies alternatives
- Current Assignee Address: FR Paris
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: FR0952598 20090421
- International Application: PCT/EP2010/055185 WO 20100420
- International Announcement: WO2010/122015 WO 20101028
- Main IPC: C23F1/00
- IPC: C23F1/00
Abstract:
A method for making a micro-device including at least one receiving site for components, formed in a thickness of a substrate. The method includes: a) making in at least one first substrate adhesively bonded to a second substrate via a discontinuous adhesive bonding interface, at least one first trench around at least one sacrificial block of the first substrate, by etching the first substrate so as to expose the adhesive bonding interface; and b) removing the sacrificial block so as to make at least one first cavity in the first substrate.
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