Invention Grant
- Patent Title: Thermosetting polymer-based composite materials
- Patent Title (中): 热固性聚合物基复合材料
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Application No.: US12357644Application Date: 2009-01-22
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Publication No.: US08487029B2Publication Date: 2013-07-16
- Inventor: Xiujun Wang
- Applicant: Xiujun Wang
- Applicant Address: US MA Rockland
- Assignee: Globe Composite Solutions, Ltd.
- Current Assignee: Globe Composite Solutions, Ltd.
- Current Assignee Address: US MA Rockland
- Agency: Michaud-Kinney Group LLP
- Main IPC: C04B28/14
- IPC: C04B28/14
Abstract:
A lead-free, non-toxic composite material including a thermosetting polymer and at least one of a heavy particulate filler, a light particulate filler or a combination thereof. The composite material may be utilized in manufacturing articles used in radiation shielding applications.
Public/Granted literature
- US20090198007A1 THERMOSETTING POLYMER-BASED COMPOSITE MATERIALS Public/Granted day:2009-08-06
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