Invention Grant
- Patent Title: Method of embedding passive component within via
- Patent Title (中): 无源元件嵌入通孔的方法
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Application No.: US13095317Application Date: 2011-04-27
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Publication No.: US08487446B2Publication Date: 2013-07-16
- Inventor: Todd B Myers , Nicolas R Watts , Eric C Palmer , Jui Min Lim
- Applicant: Todd B Myers , Nicolas R Watts , Eric C Palmer , Jui Min Lim
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52
Abstract:
A method of forming a device associated with a via includes forming an opening or via, and forming at least a pair of conducting paths within the via. Also disclosed is a via having at pair of conducting paths therein.
Public/Granted literature
- US20110198723A1 METHOD OF EMBEDDING PASSIVE COMPONENT WITHIN VIA Public/Granted day:2011-08-18
Information query
IPC分类:
