Invention Grant
US08492790B2 LED package with bounding dam surrounding LED chip and thermoset encapsulation enclosing LED chip and method for manufacturing the same
有权
LED封装LED封装围绕LED芯片和热固封装封装LED芯片及其制造方法
- Patent Title: LED package with bounding dam surrounding LED chip and thermoset encapsulation enclosing LED chip and method for manufacturing the same
- Patent Title (中): LED封装LED封装围绕LED芯片和热固封装封装LED芯片及其制造方法
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Application No.: US13029125Application Date: 2011-02-17
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Publication No.: US08492790B2Publication Date: 2013-07-23
- Inventor: Shen-Bo Lin
- Applicant: Shen-Bo Lin
- Applicant Address: TW Hsinchu Hsien
- Assignee: Advanced Optoelectronic Technology, Inc.
- Current Assignee: Advanced Optoelectronic Technology, Inc.
- Current Assignee Address: TW Hsinchu Hsien
- Agency: Altis Law Group, Inc.
- Priority: CN201010242303 20100802
- Main IPC: H01L33/52
- IPC: H01L33/52
Abstract:
An LED package includes a substrate, an LED chip, a bounding dam, and a first encapsulation. The substrate includes a first surface and a second surface opposite to the first surface. The LED chip is mounted on the first surface of the substrate. The bounding dam is formed on the first surface of the substrate and surrounds the LED chip. The bounding dam and the substrate cooperatively define a receiving space. The bounding dam is made of thermoset resin. The first encapsulation is formed in the receiving space and encloses the LED chip.
Public/Granted literature
- US20120025243A1 LED PACKAGE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2012-02-02
Information query
IPC分类:
