公开(公告)号：US08436392B2

公开(公告)日：2013-05-07

申请号：US13031582

申请日：2011-02-21

Applicant: Chao-Hsiung Chang ,  Chieh-Ling Chang ,  Shen-Bo Lin

Inventor： Chao-Hsiung Chang ,  Chieh-Ling Chang ,  Shen-Bo Lin

IPC: H01L33/48 ,  H01L33/08

CPC classification number: H01L33/486 ,  H01L25/0753 ,  H01L2224/48091 ,  H01L2924/01322 ,  H01L2933/0033 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A light emitting diode package comprises a substrate with a first surface and a second surface opposite to each other, a circuit on the substrate, a support on the substrate for reinforcing strength of the substrate, a plurality of light emitting diodes on the substrate and electrically connected to the circuit, and a cover layer on the plurality of light emitting diodes. A method for manufacturing a light-emitting diode package is further provided.

Abstract translation: 发光二极管封装包括具有彼此相对的第一表面和第二表面的衬底，衬底上的电路，用于增强衬底强度的衬底上的支撑体，衬底上的多个发光二极管和电 连接到电路，以及多个发光二极管上的覆盖层。 还提供了一种用于制造发光二极管封装的方法。

公开(公告)号：US08492790B2

公开(公告)日：2013-07-23

申请号：US13029125

申请日：2011-02-17

Applicant: Shen-Bo Lin

Inventor： Shen-Bo Lin

IPC: H01L33/52

CPC classification number: H01L33/54 ,  H01L24/97 ,  H01L33/486 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2933/005 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An LED package includes a substrate, an LED chip, a bounding dam, and a first encapsulation. The substrate includes a first surface and a second surface opposite to the first surface. The LED chip is mounted on the first surface of the substrate. The bounding dam is formed on the first surface of the substrate and surrounds the LED chip. The bounding dam and the substrate cooperatively define a receiving space. The bounding dam is made of thermoset resin. The first encapsulation is formed in the receiving space and encloses the LED chip.

Abstract translation: LED封装包括基板，LED芯片，边界坝和第一封装。 基板包括第一表面和与第一表面相对的第二表面。 LED芯片安装在基板的第一表面上。 边界坝形成在基板的第一表面上并围绕LED芯片。 边界坝和基底协调地限定了接收空间。 边界坝由热固性树脂制成。 第一封装形成在接收空间中并封装LED芯片。

公开(公告)号：US08143080B2

公开(公告)日：2012-03-27

申请号：US12941077

申请日：2010-11-07

Applicant: Shen-Bo Lin

Inventor： Shen-Bo Lin

IPC: H01L21/00

CPC classification number: H01L33/647 ,  H01L24/97 ,  H01L33/48 ,  H01L2224/48091 ,  H01L2224/97 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01065 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/00014 ,  H01L2224/85

Abstract: A method for manufacturing a number of LED packages includes following steps: providing an electrode plate and at least one insulating plate; thermally pressing the electrode plate and the at least insulating plate together, wherein the electrode has a plurality of first and second electrodes; grinding two ends of the electrode plate to expose the first and second electrodes for obtaining a substrate; disposing a plurality of LED chips on the substrate plate and electrically connecting the LED chips to the first and second electrodes; and cutting the substrate plate to obtain the number of LED packages.

Abstract translation: 制造多个LED封装的方法包括以下步骤：提供电极板和至少一个绝缘板; 将所述电极板和所述至少绝缘板热压在一起，其中所述电极具有多个第一和第二电极; 研磨电极板的两端以露出第一和第二电极以获得基底; 将多个LED芯片设置在所述基板上并将所述LED芯片电连接到所述第一和第二电极; 并切割基板以获得LED封装的数量。