Invention Grant
- Patent Title: Printed circuit boards
- Patent Title (中): 印刷电路板
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Application No.: US12526586Application Date: 2008-02-18
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Publication No.: US08492898B2Publication Date: 2013-07-23
- Inventor: Frank Ferdinandi , Rodney Edward Smith , Mark Robson Humphries
- Applicant: Frank Ferdinandi , Rodney Edward Smith , Mark Robson Humphries
- Applicant Address: GB London
- Assignee: Semblant Global Limited
- Current Assignee: Semblant Global Limited
- Current Assignee Address: GB London
- Agency: Baker Botts L.L.P.
- Priority: GB0703172.7 20070219
- International Application: PCT/GB2008/000552 WO 20080218
- International Announcement: WO2008/102113 WO 20080828
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H05K1/00
Abstract:
A printed circuit board to which a localised solder connection is to be made, the surface of said printed circuit board having a continuous or non-continuous coating of a composition comprising a halo-hydrocarbon polymer at a thickness of from 1 nm to 10 μm.
Public/Granted literature
- US20100025091A1 Printed Circuit Boards Public/Granted day:2010-02-04
Information query
IPC分类:
