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公开(公告)号：US20130334292A1
公开(公告)日：2013-12-19
申请号：US13947525
申请日：2013-07-22
Applicant: Frank Ferdinandi , Rodney Edward Smith , Mark Robson Humphries
Inventor： Frank Ferdinandi , Rodney Edward Smith , Mark Robson Humphries
CPC classification number: H05K1/02 , H01L24/45 , H01L24/48 , H01L24/85 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45686 , H01L2224/4569 , H01L2224/48225 , H01L2224/48227 , H01L2224/48245 , H01L2224/48247 , H01L2224/48647 , H01L2224/48747 , H01L2224/48847 , H01L2224/81024 , H01L2224/81395 , H01L2224/81815 , H01L2224/83024 , H01L2224/83205 , H01L2224/83395 , H01L2224/83815 , H01L2224/85203 , H01L2224/85207 , H01L2224/85395 , H01L2224/85447 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H05K3/00 , H05K3/282 , H05K3/285 , H05K3/288 , H05K3/3484 , H05K3/3489 , H05K3/3494 , H05K2201/015 , H05K2201/0179 , H05K2203/092 , H05K2203/107 , H05K2203/1338 , H05K2203/1366 , H05K2203/1372 , H05K2203/1383 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: A printed circuit board to which a localised solder connection is to be made, the surface of said printed circuit board having a continuous or non-continuous coating of a composition comprising a halo-hydrocarbon polymer at a thickness of from 1 nm to 10 μm.
Abstract translation: 印刷电路板将要制成局部焊接连接，所述印刷电路板的表面具有包含厚度为1nm至10μm的卤代烃聚合物的组合物的连续或非连续涂层。
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公开(公告)号：US20110186334A1
公开(公告)日：2011-08-04
申请号：US13030684
申请日：2011-02-18
Applicant: Mark Robson Humphries , Frank Ferdinandi , Rodney Edward Smith
Inventor： Mark Robson Humphries , Frank Ferdinandi , Rodney Edward Smith
CPC classification number: H05K1/09 , B23K1/20 , B23K20/24 , B23K31/02 , B82Y40/00 , H01L2924/01013 , H01L2924/01018 , H01L2924/01028 , H01L2924/01029 , H01L2924/01047 , H01L2924/0105 , H01L2924/01079 , H05K1/00
Abstract: In some embodiments, a printed circuit board (PCB) comprises a substrate comprising an insulating material. The PCB further comprises a plurality of conductive tracks attached to at least one surface of the substrate. The PCB further comprises a multi-layer coating deposited on the at least one surface of the substrate. The multi-layer coating (i) covers at least a portion of the plurality of conductive tracks and (ii) comprises at least one layer formed of a halo-hydrocarbon polymer. The PCB further comprises at least one electrical component connected by a solder joint to at least one conductive track, wherein the solder joint is soldered through the multi-layer coating such that the solder joint abuts the multi-layer coating.
Abstract translation: 在一些实施例中，印刷电路板（PCB）包括包含绝缘材料的基板。 PCB还包括附接到基板的至少一个表面的多个导电轨迹。 PCB还包括沉积在衬底的至少一个表面上的多层涂层。 多层涂层（i）覆盖多个导电轨道的至少一部分，（ii）包括由卤代烃聚合物形成的至少一层。 PCB还包括至少一个通过焊接接头连接到至少一个导电轨道的电气部件，其中焊接接头通过多层涂层焊接，使得焊接接头邻接多层涂层。
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公开(公告)号：US20100025091A1
公开(公告)日：2010-02-04
申请号：US12526586
申请日：2008-02-18
Applicant: Frank Ferdinandi , Rodney Edward Smith , Mark Robson Humphries
Inventor： Frank Ferdinandi , Rodney Edward Smith , Mark Robson Humphries
IPC: H05K1/09 , H05K1/02 , B23K37/00 , B05D5/12 , C23C16/513
CPC classification number: H05K1/02 , H01L24/45 , H01L24/48 , H01L24/85 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45686 , H01L2224/4569 , H01L2224/48225 , H01L2224/48227 , H01L2224/48245 , H01L2224/48247 , H01L2224/48647 , H01L2224/48747 , H01L2224/48847 , H01L2224/81024 , H01L2224/81395 , H01L2224/81815 , H01L2224/83024 , H01L2224/83205 , H01L2224/83395 , H01L2224/83815 , H01L2224/85203 , H01L2224/85207 , H01L2224/85395 , H01L2224/85447 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H05K3/00 , H05K3/282 , H05K3/285 , H05K3/288 , H05K3/3484 , H05K3/3489 , H05K3/3494 , H05K2201/015 , H05K2201/0179 , H05K2203/092 , H05K2203/107 , H05K2203/1338 , H05K2203/1366 , H05K2203/1372 , H05K2203/1383 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: A printed circuit board to which a localised solder connection is to be made, the surface of said printed circuit board having a continuous or non-continuous coating of a composition comprising a halo-hydrocarbon polymer at a thickness of from 1 nm to 10 μm.
Abstract translation: 印刷电路板将要制成局部焊接连接，所述印刷电路板的表面具有包含厚度为1nm至10μm的卤代烃聚合物的组合物的连续或非连续涂层。
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公开(公告)号：US09055700B2
公开(公告)日：2015-06-09
申请号：US13059602
申请日：2009-08-11
Applicant: Mark Robson Humphries , Frank Ferdinandi , Rodney Edward Smith
Inventor： Mark Robson Humphries , Frank Ferdinandi , Rodney Edward Smith
CPC classification number: H05K3/282 , H01H13/78 , H01H2215/004 , H01H2229/012 , H01L24/45 , H01L24/48 , H01L24/85 , H01L2224/06 , H01L2224/45014 , H01L2224/45015 , H01L2224/45105 , H01L2224/45109 , H01L2224/45111 , H01L2224/45113 , H01L2224/45116 , H01L2224/4512 , H01L2224/45124 , H01L2224/45138 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45149 , H01L2224/45155 , H01L2224/45157 , H01L2224/4516 , H01L2224/45164 , H01L2224/45166 , H01L2224/45169 , H01L2224/4517 , H01L2224/45171 , H01L2224/45173 , H01L2224/45178 , H01L2224/4518 , H01L2224/45184 , H01L2224/45565 , H01L2224/45599 , H01L2224/45644 , H01L2224/4569 , H01L2224/48091 , H01L2224/48455 , H01L2224/48463 , H01L2224/48464 , H01L2224/48599 , H01L2224/48699 , H01L2224/8502 , H01L2224/85201 , H01L2224/85205 , H01L2224/85439 , H01L2224/85444 , H01L2224/85447 , H01L2224/85484 , H01L2224/85611 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01016 , H01L2924/01018 , H01L2924/01019 , H01L2924/01021 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01025 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01031 , H01L2924/01032 , H01L2924/01033 , H01L2924/0104 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01072 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/01087 , H01L2924/01327 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/19042 , H01L2924/19043 , H01L2924/19107 , H01L2924/2075 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/3011 , H05K3/222 , H05K3/284 , H05K3/328 , H05K2201/015 , H05K2201/0179 , H05K2201/0195 , H05K2203/049 , Y10T29/49155 , H01L2924/00014 , H01L2924/00 , H01L2924/20759 , H01L2924/2076 , H01L2924/20758
Abstract: In some embodiments, a printed circuit board (PCB) comprises a substrate comprising an insulating material. The PCB further comprises a plurality of conductive tracks attached to at least one surface of the substrate. The PCB further comprises a multi-layer coating deposited on the at least one surface of the substrate. The multi-layer coating (i) covers at least a portion of the plurality of conductive tracks and (ii) comprises at least one layer formed of a halo-hydrocarbon polymer. The PCB further comprises at least one electrical component connected by a solder joint to at least one conductive track, wherein the solder joint is soldered through the multi-layer coating such that the solder joint abuts the multi-layer coating.
Abstract translation: 在一些实施例中，印刷电路板（PCB）包括包含绝缘材料的基板。 PCB还包括附接到基板的至少一个表面的多个导电轨迹。 PCB还包括沉积在衬底的至少一个表面上的多层涂层。 多层涂层（i）覆盖多个导电轨道的至少一部分，（ii）包括由卤代烃聚合物形成的至少一层。 PCB还包括至少一个通过焊接接头连接到至少一个导电轨道的电气部件，其中焊接接头通过多层涂层焊接，使得焊接接头邻接多层涂层。
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Patent Agency Ranking
公开(公告)号：US08618420B2
公开(公告)日：2013-12-31
申请号：US13030684
申请日：2011-02-18
Applicant: Mark Robson Humphries , Frank Ferdinandi , Rodney Edward Smith
Inventor： Mark Robson Humphries , Frank Ferdinandi , Rodney Edward Smith
IPC: H05K1/09
CPC classification number: H05K1/09 , B23K1/20 , B23K20/24 , B23K31/02 , B82Y40/00 , H01L2924/01013 , H01L2924/01018 , H01L2924/01028 , H01L2924/01029 , H01L2924/01047 , H01L2924/0105 , H01L2924/01079 , H05K1/00
Abstract: In some embodiments, a printed circuit board (PCB) comprises a substrate comprising an insulating material. The PCB further comprises a plurality of conductive tracks attached to at least one surface of the substrate. The PCB further comprises a multi-layer coating deposited on the at least one surface of the substrate. The multi-layer coating (i) covers at least a portion of the plurality of conductive tracks and (ii) comprises at least one layer formed of a halo-hydrocarbon polymer. The PCB further comprises at least one electrical component connected by a solder joint to at least one conductive track, wherein the solder joint is soldered through the multi-layer coating such that the solder joint abuts the multi-layer coating.
Abstract translation: 在一些实施例中，印刷电路板（PCB）包括包含绝缘材料的基板。 PCB还包括附接到基板的至少一个表面的多个导电轨迹。 PCB还包括沉积在衬底的至少一个表面上的多层涂层。 多层涂层（i）覆盖多个导电轨道的至少一部分，（ii）包括由卤代烃聚合物形成的至少一层。 PCB还包括至少一个通过焊接接头连接到至少一个导电轨道的电气部件，其中焊接接头通过多层涂层焊接，使得焊接接头邻接多层涂层。
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公开(公告)号：US08492898B2
公开(公告)日：2013-07-23
申请号：US12526586
申请日：2008-02-18
Applicant: Frank Ferdinandi , Rodney Edward Smith , Mark Robson Humphries
Inventor： Frank Ferdinandi , Rodney Edward Smith , Mark Robson Humphries
CPC classification number: H05K1/02 , H01L24/45 , H01L24/48 , H01L24/85 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45686 , H01L2224/4569 , H01L2224/48225 , H01L2224/48227 , H01L2224/48245 , H01L2224/48247 , H01L2224/48647 , H01L2224/48747 , H01L2224/48847 , H01L2224/81024 , H01L2224/81395 , H01L2224/81815 , H01L2224/83024 , H01L2224/83205 , H01L2224/83395 , H01L2224/83815 , H01L2224/85203 , H01L2224/85207 , H01L2224/85395 , H01L2224/85447 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H05K3/00 , H05K3/282 , H05K3/285 , H05K3/288 , H05K3/3484 , H05K3/3489 , H05K3/3494 , H05K2201/015 , H05K2201/0179 , H05K2203/092 , H05K2203/107 , H05K2203/1338 , H05K2203/1366 , H05K2203/1372 , H05K2203/1383 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: A printed circuit board to which a localised solder connection is to be made, the surface of said printed circuit board having a continuous or non-continuous coating of a composition comprising a halo-hydrocarbon polymer at a thickness of from 1 nm to 10 μm.
Abstract translation: 印刷电路板将要制成局部焊接连接，所述印刷电路板的表面具有包含厚度为1nm至10μm的卤代烃聚合物的组合物的连续或非连续涂层。
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公开(公告)号：US5844123A
公开(公告)日：1998-12-01
申请号：US750285
申请日：1997-02-18
Applicant: Robert Anthony Marsh , Rodney Edward Smith , Roger Kevin Starnes , John Wilfred Scarott , Colin Edwin Turner
Inventor： Robert Anthony Marsh , Rodney Edward Smith , Roger Kevin Starnes , John Wilfred Scarott , Colin Edwin Turner
IPC: G01N1/22 , G01N27/404 , G01N27/414 , G01N27/416 , G01N33/00 , G01N33/02 , G01N33/14 , G01N33/28
CPC classification number: G01N33/146 , G01N33/0042 , G01N33/02 , G01N33/0011 , G01N33/2841
Abstract: A gas sensing system is provided for the detection of gas concentrations in a flowable medium. The gas sensing system has a gas permeable membrane structure to separate the flowable medium from a chamber where a gas sensor is positioned for detecting the gas concentration in the chamber. The sensor has predetermined environmental operating ranges and the system has a heat drain with a heat sink to maintain the temperature of gas in the chamber within the operating ranges, together with gas nozzles leading into the chamber to purge gas in the chamber and to maintain the gas concentration from exceeding the sensor operating range.
Abstract translation: PCT No.PCT / GB95 / 01243 Sec。 371日期1997年2月18日 102（e）1997年2月18日日期PCT提交1995年5月30日PCT公布。 公开号WO95 / 33202 日期1995年12月7日提供了一种气体传感系统，用于检测可流动介质中的气体浓度。 气体传感系统具有透气膜结构，以将可流动介质与气体传感器定位的腔室分离，以便检测腔室中的气体浓度。 传感器具有预定的环境操作范围，并且系统具有散热器的散热，以将腔室中的气体温度保持在工作范围内，以及通向腔室的气体喷嘴，以吹扫腔室中的气体并维持 气体浓度超过传感器工作范围。
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公开(公告)号：US09648720B2
公开(公告)日：2017-05-09
申请号：US13947525
申请日：2013-07-22
Applicant: Frank Ferdinandi , Rodney Edward Smith , Mark Robson Humphries
Inventor： Frank Ferdinandi , Rodney Edward Smith , Mark Robson Humphries
CPC classification number: H05K1/02 , H01L24/45 , H01L24/48 , H01L24/85 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45686 , H01L2224/4569 , H01L2224/48225 , H01L2224/48227 , H01L2224/48245 , H01L2224/48247 , H01L2224/48647 , H01L2224/48747 , H01L2224/48847 , H01L2224/81024 , H01L2224/81395 , H01L2224/81815 , H01L2224/83024 , H01L2224/83205 , H01L2224/83395 , H01L2224/83815 , H01L2224/85203 , H01L2224/85207 , H01L2224/85395 , H01L2224/85447 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H05K3/00 , H05K3/282 , H05K3/285 , H05K3/288 , H05K3/3484 , H05K3/3489 , H05K3/3494 , H05K2201/015 , H05K2201/0179 , H05K2203/092 , H05K2203/107 , H05K2203/1338 , H05K2203/1366 , H05K2203/1372 , H05K2203/1383 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: A method including: attaching a plurality of conductive tracks to at least one surface of a substrate, depositing a coating comprising at least one halo-hydrocarbon polymer on the at least one surface of the substrate, and soldering through the coating.
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公开(公告)号：US20110253429A1
公开(公告)日：2011-10-20
申请号：US13059602
申请日：2009-08-11
Applicant: Mark Robson Humphries , Frank Ferdinandi , Rodney Edward Smith
Inventor： Mark Robson Humphries , Frank Ferdinandi , Rodney Edward Smith
CPC classification number: H05K3/282 , H01H13/78 , H01H2215/004 , H01H2229/012 , H01L24/45 , H01L24/48 , H01L24/85 , H01L2224/06 , H01L2224/45014 , H01L2224/45015 , H01L2224/45105 , H01L2224/45109 , H01L2224/45111 , H01L2224/45113 , H01L2224/45116 , H01L2224/4512 , H01L2224/45124 , H01L2224/45138 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45149 , H01L2224/45155 , H01L2224/45157 , H01L2224/4516 , H01L2224/45164 , H01L2224/45166 , H01L2224/45169 , H01L2224/4517 , H01L2224/45171 , H01L2224/45173 , H01L2224/45178 , H01L2224/4518 , H01L2224/45184 , H01L2224/45565 , H01L2224/45599 , H01L2224/45644 , H01L2224/4569 , H01L2224/48091 , H01L2224/48455 , H01L2224/48463 , H01L2224/48464 , H01L2224/48599 , H01L2224/48699 , H01L2224/8502 , H01L2224/85201 , H01L2224/85205 , H01L2224/85439 , H01L2224/85444 , H01L2224/85447 , H01L2224/85484 , H01L2224/85611 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01016 , H01L2924/01018 , H01L2924/01019 , H01L2924/01021 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01025 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01031 , H01L2924/01032 , H01L2924/01033 , H01L2924/0104 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01072 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/01087 , H01L2924/01327 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/19042 , H01L2924/19043 , H01L2924/19107 , H01L2924/2075 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/3011 , H05K3/222 , H05K3/284 , H05K3/328 , H05K2201/015 , H05K2201/0179 , H05K2201/0195 , H05K2203/049 , Y10T29/49155 , H01L2924/00014 , H01L2924/00 , H01L2924/20759 , H01L2924/2076 , H01L2924/20758
Abstract: In some embodiments, a printed circuit board (PCB) comprises a substrate comprising an insulating material. The PCB further comprises a plurality of conductive tracks attached to at least one surface of the substrate. The PCB further comprises a multi-layer coating deposited on the at least one surface of the substrate. The multi-layer coating (i) covers at least a portion of the plurality of conductive tracks and (ii) comprises at least one layer formed of a halo-hydrocarbon polymer. The PCB further comprises at least one electrical component connected by a solder joint to at least one conductive track, wherein the solder joint is soldered through the multi-layer coating such that the solder joint abuts the multi-layer coating.
Abstract translation: 在一些实施例中，印刷电路板（PCB）包括包含绝缘材料的基板。 PCB还包括附接到基板的至少一个表面的多个导电轨迹。 PCB还包括沉积在衬底的至少一个表面上的多层涂层。 多层涂层（i）覆盖多个导电轨道的至少一部分，（ii）包括由卤代烃聚合物形成的至少一层。 PCB还包括至少一个通过焊接接头连接到至少一个导电轨道的电气部件，其中焊接接头通过多层涂层焊接，使得焊接接头邻接多层涂层。
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