Invention Grant
- Patent Title: Lid attach process
- Patent Title (中): 盖附件过程
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Application No.: US11379741Application Date: 2006-04-21
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Publication No.: US08497162B1Publication Date: 2013-07-30
- Inventor: Seah Sun Too , Maxat Touzelbaev , Janet Kirkland
- Applicant: Seah Sun Too , Maxat Touzelbaev , Janet Kirkland
- Applicant Address: US CA Sunnyvale
- Assignee: Advanced Micro Devices, Inc.
- Current Assignee: Advanced Micro Devices, Inc.
- Current Assignee Address: US CA Sunnyvale
- Agent Timothy M. Honeycutt
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
Various methods of attaching a lid to an integrated circuit substrate are provided. In one aspect, a method of attaching a lid to a substrate that has an integrated circuit positioned thereon is provided. An adhesive is applied to the substrate and an indium film is applied to the integrated circuit. The lid is positioned on the adhesive. The adhesive is partially hardened and the indium film is reflowed. The adhesive is cured.
Information query
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