An adhesion bond between a metallic surface layer and a second surface is formed by treating the layers with a material comprising sulphur-containing molecules. The sulphur-containing molecules are applied as a surface treatment of the surfaces, so that the sulphur-containing molecules act as a coupling agent to bond chemically to both substrates form nanometer-sized structures on the surfaces. The nanometer-sized structures are incorporated into a self-assembly interlayer in between the surfaces, with the interlayer forming a bond to both surfaces.