Invention Grant
- Patent Title: Pattern measurement apparatus and pattern measurement method
- Patent Title (中): 图案测量装置和图案测量方法
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Application No.: US13652110Application Date: 2012-10-15
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Publication No.: US08507858B2Publication Date: 2013-08-13
- Inventor: Hiroshi Fukaya , Yoshiaki Ogiso
- Applicant: Advantest Corporation
- Applicant Address: JP Tokyo
- Assignee: Advantest Corp.
- Current Assignee: Advantest Corp.
- Current Assignee Address: JP Tokyo
- Agency: Muramatsu & Associates
- Priority: JP2011-234546 20111026
- Main IPC: H01J37/26
- IPC: H01J37/26 ; H01J37/28 ; H01J37/244

Abstract:
Referring to design data for a sample, a measurement region is defined at a portion in the design data which has no step in an edge of a pattern. In addition, an edge as a characteristic portion is detected from the design data, and an edge as a characteristic portion corresponding to the characteristic portion of the design data is detected from a secondary electron image. Then, the measurement region is positioned and located in a secondary electron image based on a positional relationship between the edge of the design data and the edge of the secondary electron image. A width of the pattern is measured on the basis of a distance between the two edges included in the measurement region thus located.
Public/Granted literature
- US20130105691A1 PATTERN MEASUREMENT APPARATUS AND PATTERN MEASUREMENT METHOD Public/Granted day:2013-05-02
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