Invention Grant
- Patent Title: Radio frequency device and method for fabricating the same
- Patent Title (中): 射频装置及其制造方法
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Application No.: US12563434Application Date: 2009-09-21
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Publication No.: US08507987B2Publication Date: 2013-08-13
- Inventor: Sheng-Yi Huang , Cheng-Chou Hung , Tzung-Lin Li , Chin-Lan Tseng , Victor-Chiang Liang , Chih-Yu Tseng
- Applicant: Sheng-Yi Huang , Cheng-Chou Hung , Tzung-Lin Li , Chin-Lan Tseng , Victor-Chiang Liang , Chih-Yu Tseng
- Applicant Address: TW Hsinchu
- Assignee: United Microelectronics Corp.
- Current Assignee: United Microelectronics Corp.
- Current Assignee Address: TW Hsinchu
- Agent Ding Yu Tan
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L21/336

Abstract:
A radio frequency (RF) device that can achieve high frequency response while maintaining high output impedance and high breakdown voltage includes a substrate, a gate, at least a dummy gate, at least a doped region, a source region and a drain region. The substrate includes a well of first type and a well of second type. The well of second type is adjacent to the well of first type.
Public/Granted literature
- US20110068415A1 Radio Frequency Device and Method for Fabricating the Same Public/Granted day:2011-03-24
Information query
IPC分类: