Invention Grant
- Patent Title: MEMS device
- Patent Title (中): MEMS器件
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Application No.: US13079988Application Date: 2011-04-05
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Publication No.: US08525277B2Publication Date: 2013-09-03
- Inventor: Shogo Inaba
- Applicant: Shogo Inaba
- Applicant Address: JP
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JP2010-087576 20100406
- Main IPC: H01L29/84
- IPC: H01L29/84
Abstract:
A MEMS device includes a substrate, an insulating layer section formed above the substrate and having a cavity, a functional element contained in the cavity, and a fuse element contained in the cavity and electrically connected with the functional element. It is preferable that the fuse element is spaced apart from the substrate.
Public/Granted literature
- US20110241136A1 MEMS DEVICE Public/Granted day:2011-10-06
Information query
IPC分类:
