Invention Grant
US08559213B2 Sub-threshold memory cell circuit with high density and high robustness
有权
子阈值存储单元电路具有高密度和高鲁棒性
- Patent Title: Sub-threshold memory cell circuit with high density and high robustness
- Patent Title (中): 子阈值存储单元电路具有高密度和高鲁棒性
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Application No.: US13322859Application Date: 2009-08-13
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Publication No.: US08559213B2Publication Date: 2013-10-15
- Inventor: Jun Yang , Na Bai , Jie Li , Chen Hu , Longxing Shi
- Applicant: Jun Yang , Na Bai , Jie Li , Chen Hu , Longxing Shi
- Applicant Address: CN
- Assignee: Southeast University
- Current Assignee: Southeast University
- Current Assignee Address: CN
- Agency: Schmeiser, Olsen & Watts LLP
- International Application: PCT/CN2009/073250 WO 20090813
- International Announcement: WO2011/017443 WO 20110217
- Main IPC: G11C11/00
- IPC: G11C11/00

Abstract:
A high-density and high-robustness sub-threshold memory cell circuit, having two PMOS transistors P1 and P2 and five NMOS transistors N1˜N5, wherein, the each base electrode of the two PMOS transistors and NMOS transistors N3, N4, and N5 is connected with the local grid electrode respectively; the base electrode of the NMOS transistors N1 and N2, are grounded respectively; the NMOS transistor N1 form an phase inverter with the PMOS transistor P1, and the NMOS transistor N2 form another phase inverter with the PMOS transistor P2; the two phase inverters are connected with each other in a cross coupling manner via the cut-off NMOS transistor N5, the output end of the phase inverter N1 and P1 directly connected to the input end of the phase inverter N2 and P2, and the output end of the phase inverter N2 and P2 connected to the input end of the phase inverter N1 and P1 via the cut-off NMOS transistor N5; the NMOS transistor N3 is connected with the write bit line (WBL) of the phase inverter N1 and P1, and the NMOS transistor N4 is connected with the NOT WBL and read word line (RWL) of the phase inverter N2 and P2.
Public/Granted literature
- US20120069650A1 SUB-THRESHOLD MEMORY CELL CIRCUIT WITH HIGH DENSITY AND HIGH ROBUSTNESS Public/Granted day:2012-03-22
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