Invention Grant
- Patent Title: Silicon microphone package
- Patent Title (中): 硅麦克风包
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Application No.: US12786723Application Date: 2010-05-25
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Publication No.: US08571249B2Publication Date: 2013-10-29
- Inventor: Yunlong Wang
- Applicant: Yunlong Wang
- Applicant Address: US CA Sunnyvale
- Assignee: General MEMS Corporation
- Current Assignee: General MEMS Corporation
- Current Assignee Address: US CA Sunnyvale
- Agency: McClure, Qualey & Rodack, LLP
- Main IPC: H04R9/08
- IPC: H04R9/08 ; H04R11/04 ; H04R25/00 ; H01L23/12
Abstract:
A silicon microphone package is provided, including an integrated microphone die having opposing first and second surfaces, a first cover member formed over the first surface of the integrated microphone die to form a first chamber therebetween, and a second cover member formed over the second surface of the integrated microphone die to form a second chamber therebetween.
Public/Granted literature
- US20100303271A1 SILICON MICROPHONE PACKAGE Public/Granted day:2010-12-02
Information query
