Cup lid
    2.
    外观设计
    Cup lid 有权

    公开(公告)号:USD996890S1

    公开(公告)日:2023-08-29

    申请号:US29860741

    申请日:2022-11-22

    Applicant: Yunlong Wang

    Designer: Yunlong Wang

    Abstract: FIG. 1 is a front, left and top perspective view of a cup lid showing my design.
    FIG. 2 is a rear, right and bottom perspective view of a cup lid showing my design.
    FIG. 3 is a front elevation view thereof.
    FIG. 4 is a rear elevation view thereof.
    FIG. 5 is a left-side elevation view thereof.
    FIG. 6 is a right-side elevation view thereof.
    FIG. 7 is a top plan view thereof; and,
    FIG. 8 is a bottom plan view thereof.
    The broken lines are included for the purposes of illustrating portions of the cup lid that form no part of the claimed design.

    Lateral mode capacitive microphone with acceleration compensation

    公开(公告)号:US10244330B2

    公开(公告)日:2019-03-26

    申请号:US15623339

    申请日:2017-06-14

    Abstract: The present invention provides a lateral microphone including a MEMS microphone. In the microphone, a movable or deflectable membrane/diaphragm moves in a lateral manner relative to the fixed backplate, instead of moving toward/from the fixed backplate. A motional sensor is used in the microphone to estimate the noise introduced from acceleration or vibration of the microphone for the purpose of compensating the microphone output through a signal subtraction operation. In an embodiment, the motional sensor is identical to the lateral microphone, except that the movable membrane in the motional sensor has air ventilation holes for lowering the movable membrane's air resistance, and making the movable membrane responsive only to acceleration or vibration of the microphone.

    Micromachined capacitive RF pressure sensor
    4.
    发明授权
    Micromachined capacitive RF pressure sensor 失效
    微加工电容式RF压力传感器

    公开(公告)号:US06945115B1

    公开(公告)日:2005-09-20

    申请号:US10708443

    申请日:2004-03-04

    Applicant: Yunlong Wang

    Inventor: Yunlong Wang

    CPC classification number: G01L9/0073 G01L9/0086

    Abstract: A Capacitive Micromachined Ultrasonic RF (CMURF) pressure sensor is described. This micromachined pressure sensor has: pressure sensitive capacitance elements including a scalable array of micromachined cells of the type including electrodes carried by a sealed membrane supported above a common electrode with conductive lines interconnecting the electrodes having an electrostatic capacitance ΔCm changing with a pressure to be detected; reference capacitance elements including a scalable array of micromachined cells of the type including electrodes carried by a stacked of membranes supported above a common electrode with conductive lines interconnecting the electrodes having an electrostatic capacitance Cm not changing with the pressure. A method of operating a pressure sensor array is also described.

    Abstract translation: 描述了电容式微加工超声波(CMURF)压力传感器。 该微加工压力传感器具有:压敏电容元件,其包括可加工的微加工电池单元阵列,其包括由公共电极上支撑的密封膜承载的电极,导电线将具有静电电容DeltaC 改变压力要检测; 参考电容元件包括这种类型的微加工电池的可伸缩阵列,包括由共同电极支撑的层叠的电极承载的电极,导电线互连具有不随压力变化的静电电容C m的电极 。 还描述了操作压力传感器阵列的方法。

    Miniature MEMS condenser microphone packages and fabrication method thereof
    5.
    发明授权
    Miniature MEMS condenser microphone packages and fabrication method thereof 有权
    微型MEMS电容麦克风封装及其制造方法

    公开(公告)号:US08325951B2

    公开(公告)日:2012-12-04

    申请号:US12689283

    申请日:2010-01-19

    Applicant: Yunlong Wang

    Inventor: Yunlong Wang

    Abstract: MEMS microphone packages and fabrication methods thereof are disclosed. A MEMS microphone package includes a cavity that houses a MEMS sensing element, an IC chip and other passive elements supported by a common substrate. The cavity is formed by a top cover member, a housing wall surrounds and supports the top cover member and the common substrate supports the housing wall. A conductive casing encloses and surrounds the cavity, and is electrically connected to a common analog ground lead on a PCB board. The top cover member and the housing wall are non-conductive. And the conductive casing is not connected directly to the ground leads of the package. An acoustic absorption layer is sandwiched between the conductive casing and the cavity which is formed by the top cover member, the housing wall and the substrate.

    Abstract translation: 公开了MEMS麦克风封装及其制造方法。 MEMS麦克风封装包括容纳MEMS感测元件,IC芯片和由公共基板支撑的其它无源元件的空腔。 空腔由顶盖构件形成,壳体壁围绕并支撑顶盖构件,并且公共衬底支撑壳体壁。 导电外壳包围并围绕空腔,并且电连接到PCB板上的公共模拟接地引线。 顶盖构件和外壳壁不导电。 并且导电套管不直接连接到封装的接地引线。 声吸收层被夹在导电壳体和由顶盖构件,壳体壁和基底形成的空腔之间。

    Micromachined fluid ejector array
    6.
    发明授权
    Micromachined fluid ejector array 有权
    微加工液体喷射器阵列

    公开(公告)号:US08042916B2

    公开(公告)日:2011-10-25

    申请号:US11694943

    申请日:2007-03-31

    Applicant: Yunlong Wang

    Inventor: Yunlong Wang

    CPC classification number: B41J2/14201 B41J2/1607 B41J2/1632

    Abstract: This invention relates to a micromachined fluid ejector array having a fluid reservoir bounded at one side by an elastic membrane having scalable arrays of orifices arranged between concentric piezoelectric transducers, and at another side by a top cover supported by surrounding walls. By actuating neighboring concentric piezoelectric transducers, the scalable array of orifices arranged between the actuated neighboring concentric piezoelectric transducers deflect to eject fluid droplets. Also disclosed is a micromachined fluid ejector array having a fluid reservoir bounded at one side by an elastic membrane having scalable arrays of orifices arranged between concentric piezoelectric transducers, and at another side by a top cover supported by surrounding walls. A piezoelectric layer is bonded on top of the top cover. By actuating the piezoelectric layer bonded on top of the top cover, the scalable arrays of orifices arranged between the neighboring concentric piezoelectric transducers deflect in phase to eject fluid droplets.

    Abstract translation: 本发明涉及一种微加工流体喷射器阵列,其具有在一侧由一个弹性膜限定的流体储存器,所述弹性膜具有可排列在同心压电换能器之间的孔的可排列阵列,另一侧由由周围壁支撑的顶盖组成。 通过致动相邻的同心压电换能器,布置在致动的相邻同心压电换能器之间的可缩放的孔阵列偏转以喷射液滴。 还公开了一种微加工流体喷射器阵列,其具有在一侧由一个弹性膜限定的流体储存器,所述弹性膜具有可排列在同心压电换能器之间的孔的可排列阵列,另一侧由被周围壁支撑的顶盖组成。 压电层结合在顶盖的顶部。 通过致动接合在顶盖顶部上的压电层,布置在相邻的同心压电换能器之间的可缩放阵列阵列相位偏转以喷射液滴。

    Micromachined diagnostic device with controlled flow of fluid and reaction
    7.
    发明授权
    Micromachined diagnostic device with controlled flow of fluid and reaction 有权
    微加工诊断装置具有受控流体流动和反应

    公开(公告)号:US07598091B2

    公开(公告)日:2009-10-06

    申请号:US11694945

    申请日:2007-03-31

    Applicant: Yunlong Wang

    Inventor: Yunlong Wang

    CPC classification number: G01N33/54386 G01N33/558

    Abstract: This invention relates to a micromachined microfluidics diagnostic device that comprises one or multiple assaying channels each of which is comprised a sample port, a first valve, a reaction chamber, a second valve, a fluid ejector array, a third valve, a buffer chamber, a capture zone and a waste chamber. Each of these device components are interconnected through microfluidic channels. This invention further relates to the method of operating a micromachined microfluidic diagnostic device. The flow of fluid in the microchannels is regulated through micromachined valves. The reaction of sample analytes with fluorescent tags and detection antibodies in the reaction chamber are enhanced by the micromachined active mixer. By ejecting reaction mixture onto the capture zone through micromachined fluid ejector array, the fluorescent tagged analytes bind with capturing antiodies on capture zone. The fluid ejector array further ejects buffer fluid to wash away unbound fluorescent tags.

    Abstract translation: 本发明涉及一种微加工微流体诊断装置,其包括一个或多个测定通道,每个测定通道包括样品端口,第一阀,反应室,第二阀,流体喷射器阵列,第三阀,缓冲室, 捕获区和废物室。 这些器件组件中的每一个通过微流体通道相互连接。 本发明还涉及微加工微流体诊断装置的操作方法。 微通道中的流体流动通过微加工阀来调节。 样品分析物与反应室中的荧光标签和检测抗体的反应通过微加工的活性混合器增强。 通过微型加工流体喷射器阵列将反应混合物喷射到捕获区上,荧光标记的分析物与捕获区上的捕获抗体结合。 流体喷射器阵列进一步喷射缓冲液以洗去未结合的荧光标签。

    Capacitive micromachined acoustic transducer
    8.
    发明授权
    Capacitive micromachined acoustic transducer 失效
    电容式微机械声换能器

    公开(公告)号:US07152481B2

    公开(公告)日:2006-12-26

    申请号:US10907706

    申请日:2005-04-13

    Applicant: Yunlong Wang

    Inventor: Yunlong Wang

    CPC classification number: H04R19/005 B81B3/0072 B81B2201/0257 B81B2203/0127

    Abstract: A micromachined capacitive acoustic transducer including an electrode formed by a perforated plate and another electrode formed by a shallowly corrugated membrane anchored at one or more positions on the substrate which also supports the said perforated plate is described. Also disclosed includes: a fixed perforated plate; a movable shallowly corrugated membrane having holes to form acoustic filter to a certain frequency or a range of frequencies spaced from the perforated plate that is anchored in one or more location but loose at other locations; a support structure in the perforated plate maintaining the minimum separation between the membrane and the perforated plate near the perimeter.

    Abstract translation: 描述了一种微加工电容式声学换能器,其包括由多孔板形成的电极和由支撑所述多孔板的基板上的一个或多个位置处锚定的浅波纹膜形成的另一电极。 还公开了一种固定多孔板; 可移动的浅波纹膜,其具有孔,以形成声音过滤器到与多孔板间隔开的固定在一个或多个位置但在其它位置处松动的一定频率或一定范围的频率; 多孔板中的支撑结构保持隔膜和周边附近的多孔板之间的最小间隔。

    Capacitive microphone having capability of acceleration noise cancelation

    公开(公告)号:US10715928B2

    公开(公告)日:2020-07-14

    申请号:US16270574

    申请日:2019-02-07

    Abstract: The present invention provides a capacitive microphone having a capability of acceleration noise cancelation. The microphone includes (1) a moveable functional membrane comprising a basic functional membrane with an area Ao; and (2) a moveable reference membrane comprising a basic reference membrane. The basic reference membrane has one or more holes through the membrane's thickness, and the moveable reference membrane would be identical to the moveable functional membrane if the basic reference membrane does not have said one or more holes. The total area of said one or more holes is Ah, and a hole density HD is defined as Ah/Ao (%), and HD is in the range of e.g. from 0.012% to 2.647%.

    Silicon microphone package
    10.
    发明授权
    Silicon microphone package 有权
    硅麦克风包

    公开(公告)号:US08571249B2

    公开(公告)日:2013-10-29

    申请号:US12786723

    申请日:2010-05-25

    Applicant: Yunlong Wang

    Inventor: Yunlong Wang

    CPC classification number: H04R19/005 H04R19/04 H04R31/00

    Abstract: A silicon microphone package is provided, including an integrated microphone die having opposing first and second surfaces, a first cover member formed over the first surface of the integrated microphone die to form a first chamber therebetween, and a second cover member formed over the second surface of the integrated microphone die to form a second chamber therebetween.

    Abstract translation: 提供了一种硅麦克风封装,包括具有相对的第一和第二表面的集成式麦克风模具,形成在集成麦克风模具的第一表面上方以在其间形成第一室的第一盖构件和形成在第二表面上的第二盖构件 以在其间形成第二腔室。

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