A method for manufacturing a rigid-flexible printed circuit boards includes following steps. First, a first rigid substrate is attached to a first adhesive layer. Second, a first opening through the combined first rigid substrate and the first adhesive layer is defined. Third, the first rigid substrate is laminated to a flexible substrate, the flexible substrate includes an exposed portion exposed via the first opening. Fourth, a second rigid substrate is attached to a second adhesive, a glass transition temperature of the second adhesive layer being lower than that of the first adhesive layer. Fifth, a second opening through the combined first rigid substrate and the first adhesive layer is defined. Sixth, the second rigid substrate is laminated to the flexible substrate in such a manner that the flexible substrate is sandwiched between the first and second adhesive layers, the exposed portion is exposed in the first and the second openings.