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    Printed circuit board module
    1.
    发明授权
    Printed circuit board module 有权
    印刷电路板模块

    公开(公告)号：US08251712B2

    公开(公告)日：2012-08-28

    申请号：US12979369

    申请日：2010-12-28

    Applicant: Chien-Pang Cheng

    Inventor： Chien-Pang Cheng

    IPC: H01R12/00

    CPC classification number: H01R12/7082 ,  H01R12/721 ,  H01R12/73 ,  H05K1/144 ,  H05K1/147 ,  H05K3/365 ,  H05K2201/0133 ,  H05K2201/0311 ,  H05K2201/042 ,  H05K2201/10409 ,  H05K2201/2036

    Abstract: A PCB module includes a first rigid PCB having a first edge connector, a second rigid PCB having a second edge connector, and a connecting mechanism. The connecting mechanism includes a flexible connecting board, an elastic member, and a fixing member. The flexible connecting has a number of connecting circuit traces isolated from each other. The flexible connecting board is bent in such a manner that a first end portion is in contact with the first edge connector, and a second end portion is in contact with the second edge connector. Thus, the first edge connector is electrically connected with the second edge connector by the traces. The elastic member is compressed between the end portions of the flexible connecting board. The fixing member is configured to fix the first rigid PCB to the second rigid PCB and compress the elastic member.

    Abstract translation: PCB模块包括具有第一边缘连接器的第一刚性PCB，具有第二边缘连接器的第二刚性PCB以及连接机构。 连接机构包括柔性连接板，弹性部件和固定部件。 柔性连接具有彼此隔离的多个连接电路迹线。 柔性连接板弯曲成使得第一端部与第一边缘连接器接触，并且第二端部与第二边缘连接器接触。 因此，第一边缘连接器通过迹线与第二边缘连接器电连接。 弹性构件在柔性连接板的端部之间被压缩。 固定构件被构造成将第一刚性PCB固定到第二刚性PCB并压缩弹性构件。

    Printed circuit board with fins
    2.
    发明授权
    Printed circuit board with fins 有权
    带散热片的印刷电路板

    公开(公告)号：US08735728B2

    公开(公告)日：2014-05-27

    申请号：US13049906

    申请日：2011-03-17

    Applicant: Chien-Pang Cheng

    Inventor： Chien-Pang Cheng

    IPC: H05K1/00

    CPC classification number: H05K7/205 ,  H05K1/0206 ,  H05K1/0209 ,  H05K1/0219 ,  H05K2201/0367 ,  H05K2201/09736

    Abstract: A printed circuit board includes an insulating layer, a signal trace, a ground trace, and a fin. The insulating layer has a first surface and an opposite second surface. The signal trace and the ground trace are formed on the first surface of the insulating layer. The first fin is directly formed on the ground trace. Also provided is a method for manufacturing the printed circuit board.

    Abstract translation: 印刷电路板包括绝缘层，信号迹线，接地迹线和鳍片。 绝缘层具有第一表面和相对的第二表面。 在绝缘层的第一表面上形成信号迹线和接地迹线。 第一个翅片直接形成在地面上。 还提供了制造印刷电路板的方法。

    Apparatus and method for pressing printed circuit board
    4.
    发明授权
    Apparatus and method for pressing printed circuit board 有权
    压印印刷电路板的装置及方法

    公开(公告)号：US08567468B2

    公开(公告)日：2013-10-29

    申请号：US13308560

    申请日：2011-12-01

    Applicant: Chien-Pang Cheng

    Inventor： Chien-Pang Cheng

    IPC: B30B9/00 ,  B30B15/34

    CPC classification number: B32B37/10 ,  B32B37/06 ,  B32B37/1207 ,  B32B2457/08

    Abstract: An apparatus for heating and pressing a printed circuit board includes a first pressing member, a second pressing member, a driving member, a heater and an electromagnetic assembly. The driving member is configured for driving the first pressing member and the second pressing member to move toward or away from each other. The heater is configured for heating one of the first and second walls, and the electromagnetic assembly is capable of generating a magnetic field to attract the second wall to create additional pressure.

    Abstract translation: 一种用于加热和压制印刷电路板的设备包括第一按压部件，第二按压部件，驱动部件，加热器和电磁组件。 所述驱动构件被构造成用于驱动所述第一按压构件和所述第二按压构件朝向或远离彼此移动。 加热器被配置为加热第一和第二壁之一，并且电磁组件能够产生磁场以吸引第二壁以产生额外的压力。

    Clamping apparatus
    5.
    发明授权
    Clamping apparatus 失效
    夹紧装置

    公开(公告)号：US08454005B2

    公开(公告)日：2013-06-04

    申请号：US13094808

    申请日：2011-04-26

    Applicant: Chien-Pang Cheng

    Inventor： Chien-Pang Cheng

    IPC: B25B1/24

    CPC classification number: H05K13/0069

    Abstract: A clamping apparatus includes a receiving frame, a guide plate, two drive assemblies, and two clamping assemblies. The receiving frame includes two parallel securing arms and a connection arm. The securing arms and the connection arm define a first receiving space. Each of the securing arms defines a slot. The guide plate is configured for mounting of a workpiece thereon. The drive assemblies are configured for cooperatively moving the guide plate between a first position and a second position. When the guide plate is located at the first position, the workpiece is loaded on the guide plate and distant from the connection arm. When the guide plate is located at the second position, the workpiece is adjacent to the connection arm and entirely received in the first receiving space and the slots. The clamping assemblies are configured for cooperatively clamping the workpiece.

    Abstract translation: 夹紧装置包括接收框架，导向板，两个驱动组件和两个夹紧组件。 接收框架包括两个平行的固定臂和连接臂。 固定臂和连接臂限定第一容纳空间。 每个固定臂限定一个槽。 引导板构造成用于在其上安装工件。 驱动组件构造成用于在第一位置和第二位置之间协调地移动引导板。 当导板位于第一位置时，工件被装载在引导板上并且远离连接臂。 当导板位于第二位置时，工件与连接臂相邻并且完全接收在第一容纳空间和槽中。 夹紧组件被构造成用于协同地夹紧工件。

    Method for manufacturing multilayer printed circuit board
    6.
    发明授权
    Method for manufacturing multilayer printed circuit board 有权
    多层印刷电路板制造方法

    公开(公告)号：US08997343B2

    公开(公告)日：2015-04-07

    申请号：US13108991

    申请日：2011-05-17

    Applicant: Chien-Pang Cheng

    Inventor： Chien-Pang Cheng

    IPC: H01K3/10 ,  H05K3/46 ,  H05K3/06 ,  H05K3/40

    CPC classification number: H05K3/4635 ,  H05K3/06 ,  H05K3/4069 ,  H05K2201/055 ,  H05K2203/0228 ,  H05K2203/0733 ,  Y10T29/49126 ,  Y10T29/49156 ,  Y10T29/49165

    Abstract: A method for manufacturing multilayer printed circuit board includes step below. A metal substrate is provide, the metal substrate includes a number of substrate unit. A first insulating layer is formed on one surface of the metal substrate. The first insulating layer has a number of first through holes. An electrically conductive circuit is formed in each substrate unit. A second insulating layer is formed on the other surface of the metal substrate. The second insulating layer has a number of second through holes. A first metal cylinder is formed in a first through hole and a second metal cylinder is formed in a second through hole. The number of substrate units are folded and laminated, the connected and aligned first metal cylinder and the second metal cylinder communicates the electrically conductive circuits.

    Abstract translation: 一种制造多层印刷电路板的方法包括以下步骤。 提供金属基板，金属基板包括多个基板单元。 第一绝缘层形成在金属基板的一个表面上。 第一绝缘层具有多个第一通孔。 在每个基板单元中形成导电电路。 在金属基板的另一个表面上形成第二绝缘层。 第二绝缘层具有多个第二通孔。 第一金属圆筒形成在第一通孔中，第二金属圆筒形成在第二通孔中。 基板单元的数量被折叠和层压，连接和对准的第一金属圆筒和第二金属圆筒连通导电电路。

    Multilayer printed circuit board and method for making same
    7.
    发明授权
    Multilayer printed circuit board and method for making same 有权
    多层印刷电路板及其制造方法

    公开(公告)号：US08723050B2

    公开(公告)日：2014-05-13

    申请号：US13233189

    申请日：2011-09-15

    Applicant: Chien-Pang Cheng

    Inventor： Chien-Pang Cheng

    IPC: H05K1/11 ,  H05K1/02 ,  H05K3/10

    CPC classification number: H05K3/4617 ,  H05K1/095 ,  H05K3/323 ,  H05K3/4069

    Abstract: An exemplary multilayer printed circuit board includes a first circuit substrate, a third circuit substrate, a second circuit substrate between the first and third circuit substrates, a first anisotropically conductive adhesive layer between the first and second circuit substrates, and a second anisotropically conductive adhesive layer between the second and third circuit substrates. The first circuit substrate includes a first conductive terminal and a first through hole. The second circuit substrate includes a second conductive terminal and two through holes (i.e. second and third through holes). The third circuit substrate includes a third conductive terminal and a fourth through hole. The first anisotropically conductive adhesive layer fills the first and third through holes to electrically connect the first and second conductive terminals. The second anisotropically conductive adhesive layer fills the second and fourth through holes to electrically connect the second and third conductive terminals.

    Abstract translation: 示例性的多层印刷电路板包括第一电路基板，第三电路基板，第一和第三电路基板之间的第二电路基板，第一和第二电路基板之间的第一各向异性导电粘合剂层，以及第二各向异性导电粘合剂层 在第二和第三电路基板之间。 第一电路基板包括第一导电端子和第一通孔。 第二电路基板包括第二导电端子和两个通孔（即第二和第三通孔）。 第三电路基板包括第三导电端子和第四通孔。 第一各向异性导电粘合剂层填充第一和第三通孔以电连接第一和第二导电端子。 第二各向异性导电粘合剂层填充第二和第四通孔，以电连接第二和第三导电端子。

    Method for manufacturing rigid-flexible printed circuit board
    8.
    发明授权
    Method for manufacturing rigid-flexible printed circuit board 有权
    硬质柔性印刷电路板的制造方法

    公开(公告)号：US08580068B2

    公开(公告)日：2013-11-12

    申请号：US13046792

    申请日：2011-03-14

    Applicant: Chien-Pang Cheng

    Inventor： Chien-Pang Cheng

    IPC: B32B38/10

    CPC classification number: H05K3/4691 ,  H05K2203/063 ,  H05K2203/068

    Abstract: A method for manufacturing a rigid-flexible printed circuit boards includes following steps. First, a first rigid substrate is attached to a first adhesive layer. Second, a first opening through the combined first rigid substrate and the first adhesive layer is defined. Third, the first rigid substrate is laminated to a flexible substrate, the flexible substrate includes an exposed portion exposed via the first opening. Fourth, a second rigid substrate is attached to a second adhesive, a glass transition temperature of the second adhesive layer being lower than that of the first adhesive layer. Fifth, a second opening through the combined first rigid substrate and the first adhesive layer is defined. Sixth, the second rigid substrate is laminated to the flexible substrate in such a manner that the flexible substrate is sandwiched between the first and second adhesive layers, the exposed portion is exposed in the first and the second openings.

    Abstract translation: 制造刚柔柔性印刷电路板的方法包括以下步骤。 首先，将第一刚性基板附接到第一粘合剂层。 其次，定义了通过组合的第一刚性基板和第一粘合剂层的第一开口。 第三，将第一刚性基板层压到柔性基板上，柔性基板包括经由第一开口露出的暴露部分。 第四，第二刚性基板附着到第二粘合剂上，第二粘合剂层的玻璃化转变温度低于第一粘合剂层的玻璃化转变温度。 第五，限定通过组合的第一刚性基板和第一粘合剂层的第二开口。 第六，将第二刚性基板以柔性基板夹在第一和第二粘合剂层之间的方式层压到柔性基板上，暴露部分暴露在第一和第二开口中。

    Electroplating apparatus
    9.
    发明授权
    Electroplating apparatus 失效
    电镀设备

    公开(公告)号：US08252154B2

    公开(公告)日：2012-08-28

    申请号：US12913782

    申请日：2010-10-28

    Applicant: Chien-Pang Cheng

    Inventor： Chien-Pang Cheng

    IPC: C25D17/06 ,  C25D17/08

    CPC classification number: C25D17/04

    Abstract: An electroplating apparatus includes an electroplating tank, a first supporting bar, a first holding element, two second supporting bars, a number of spaced crossbars, a number of second holding elements, and a power supply. The first holding element is suspended in the tank from the first supporting bar, and the first holding element is configured for holding a plate-shaped workpiece in a manner that the workpiece is oriented along the first supporting bar. The second holding elements are suspended from the corresponding crossbars, each of the second holding elements arranged between the first and one of the second supporting bars and configured for holding a metal block. The power supply includes a cathode for electrical connection to the workpiece through the first supporting bar and the first holding element and an anode for electrically connection to the metal blocks through the second supporting bars and the second holding elements.

    Abstract translation: 电镀设备包括电镀槽，第一支撑杆，第一保持元件，两个第二支撑杆，多个隔开的横梁，多个第二保持元件和电源。 第一保持元件从第一支撑杆悬挂在箱中，并且第一保持元件构造成用于沿着第一支撑杆定位工件以保持板状工件。 第二保持元件从相应的横梁悬挂，每个第二保持元件布置在第一和第二支撑杆之间，并且构造成用于保持金属块。 电源包括用于通过第一支撑杆和第一保持元件与工件电连接的阴极和用于通过第二支撑杆和第二保持元件电连接到金属块的阳极。

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