Invention Grant
US08592925B2 Functional device with functional structure of a microelectromechanical system disposed in a cavity of a substrate, and manufacturing method thereof 有权
具有设置在基板的空腔内的微机电系统的功能结构的功能元件及其制造方法

  • Patent Title: Functional device with functional structure of a microelectromechanical system disposed in a cavity of a substrate, and manufacturing method thereof
  • Patent Title (中): 具有设置在基板的空腔内的微机电系统的功能结构的功能元件及其制造方法
  • Application No.: US12351758
    Application Date: 2009-01-09
  • Publication No.: US08592925B2
    Publication Date: 2013-11-26
  • Inventor: Shogo Inaba
  • Applicant: Shogo Inaba
  • Applicant Address: JP Tokyo
  • Assignee: Seiko Epson Corporation
  • Current Assignee: Seiko Epson Corporation
  • Current Assignee Address: JP Tokyo
  • Agency: Kilpatrick Townsend & Stockton LLP
  • Priority: JP2008-004037 20080111; JP2008-300523 20081126
  • Main IPC: H01L29/84
  • IPC: H01L29/84
Functional device with functional structure of a microelectromechanical system disposed in a cavity of a substrate, and manufacturing method thereof
Abstract:
A functional device includes: a substrate; a functional structure formed on the substrate; a cavity in which the functional structure is disposed; and a cover which covers the cavity, wherein the cover includes a bumpy structure including rib shaped portions, or groove shaped portions, which cross a covering range covering at least the cavity.
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