Invention Grant
- Patent Title: Method and apparatus of electrical device characterization
- Patent Title (中): 电气设备表征的方法和装置
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Application No.: US13076433Application Date: 2011-03-31
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Publication No.: US08594958B2Publication Date: 2013-11-26
- Inventor: Kao-Cheng Lin , Yu-Te Kao , Wen-Jung Liao
- Applicant: Kao-Cheng Lin , Yu-Te Kao , Wen-Jung Liao
- Applicant Address: TW Science-Based Industrial Park, Hsin-Chu
- Assignee: United Microelectronics Corp.
- Current Assignee: United Microelectronics Corp.
- Current Assignee Address: TW Science-Based Industrial Park, Hsin-Chu
- Agent Winston Hsu; Scott Margo
- Main IPC: G06F19/00
- IPC: G06F19/00

Abstract:
A method of electrical device characterization comprises: providing an array of electrical devices arranged in rows and columns, wherein each electrical device has a first terminal, a second terminal and a third terminal; clamping a first voltage at a first terminal of a selected electrical device via a first buffer or an first external voltage source; clamping a second voltage at a second terminal of a selected electrical device via a second buffer or a second external voltage source; controlling a third buffer to couple the third terminal of the selected electrical device to a first terminal or a second terminal of at least one non-selected column of electrical devices; and deriving a characterization result via the third terminal of the selected electrical device; wherein the array of electrical devices, the first buffer, the second buffer and the third buffer are on a same die or a same module.
Public/Granted literature
- US20120253719A1 METHOD AND APPARATUS OF ELECTRICAL DEVICE CHARACTERIZATION Public/Granted day:2012-10-04
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