Invention Grant
US08598466B2 Controlled-impedance electronic board vias, method of forming the same, and unitized PCB incorporating the same
失效
控制阻抗电子板通孔，其形成方法，以及结合其的组合PCB
- Patent Title: Controlled-impedance electronic board vias, method of forming the same, and unitized PCB incorporating the same
- Patent Title (中): 控制阻抗电子板通孔，其形成方法，以及结合其的组合PCB
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Application No.: US13016744Application Date: 2011-01-28
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Publication No.: US08598466B2Publication Date: 2013-12-03
- Inventor: Brian S. Mantel , David T. Engquist
- Applicant: Brian S. Mantel , David T. Engquist
- Applicant Address: US OR Beaverton
- Assignee: Tektronix, Inc.
- Current Assignee: Tektronix, Inc.
- Current Assignee Address: US OR Beaverton
- Agency: Marger Johnson & McCollom, P.C.
- Agent James G. Stewart, PC; Thomas F. Lenihan
- Main IPC: H01K3/10
- IPC: H01K3/10 ; H05K1/03
Abstract:
A shielded signal pass-through or via structure integral with an electronic circuit board is described. The structure includes a rigid inner generally cylindrical conductor; at least a semi-rigid intermediate annular dielectric surrounding the conductor; and a rigid outer annular conductor surrounding the dielectric material. Also described is an interconnect device that presents a contact array in a boss region of a unitary embossed printed circuit board (PCB) optionally equipped with one or more such shielded vias.
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