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    SELF-RETAINING VIA PROBE
    1.
    发明申请
    SELF-RETAINING VIA PROBE 有权
    自我保持通过探索

    公开(公告)号：US20130033280A1

    公开(公告)日：2013-02-07

    申请号：US13197662

    申请日：2011-08-03

    Applicant: David T. ENGQUIST ,  Brian S. MANTEL

    Inventor： David T. ENGQUIST ,  Brian S. MANTEL

    IPC: G01R1/067

    CPC classification number: G01R1/06733 ,  G01R1/06788

    Abstract: A planar body is configured such that its edges engage the sidewall of a via of a device under test to create point electrical contacts and the planar body resists removal of the planar body from the via after insertion. The edges of the planar body may include barbs that create point electrical contacts and resist removal of the planar body from the via after insertion. The end of the body that is inserted into the via may form a tapered tip to facilitate insertion. The end of the planar body that is inserted into the via may include barbs that resist removal of the planar body from the via after insertion. The edges of the planar body may include stops that prevent further insertion of the planar body into the via beyond the stops.

    Abstract translation: 平面体被构造成使得其边缘接合待测器件的通路的侧壁，以产生点电触点，并且平面主体抵抗插入之后平面体从通孔的移除。 平面主体的边缘可以包括产生点电触点并且在插入之后阻止平面体从通孔去除的倒钩。 插入通孔的主体的端部可以形成锥形尖端以便于插入。 插入通孔的平面体的端部可以包括在插入之后阻止平面体从通孔去除的倒钩。 平面主体的边缘可以包括防止平面体进一步插入超过止挡件的通孔中的挡块。

    High density logic analyzer probing system
    2.
    发明授权
    High density logic analyzer probing system 失效
    高密度逻辑分析仪探测系统

    公开(公告)号：US06888361B1

    公开(公告)日：2005-05-03

    申请号：US10856373

    申请日：2004-05-27

    Applicant: David T. Engquist

    Inventor： David T. Engquist

    IPC: G01R31/28 ,  G01R31/3177 ,  G01R31/02

    CPC classification number: G01R31/2808 ,  G01R31/3177

    Abstract: A high density logic analyzer probing system has a probe mounting fixture for accurately positioning mounting posts to a device under test (DUT). The mounting posts includes a recess in one side for receiving a spring wire clip that mounts through holes in the DUT. The housing includes protrusions that receive screws for securing the probe head to the mounting posts on the DUT. The screws have a first shoulder that engages the protrusions and a second shoulder that engages the mounting post. The probe head is positioned between the mounting posts and tightened to the DUT using the screws. The first shoulder applies downward pressure on the probe head and the second shoulder provides a positive stop to prevent over tightening of the probe head which can cause damage to probe contacts in the probe head.

    Abstract translation: 高密度逻辑分析仪探测系统具有用于将安装柱精确定位到被测设备（DUT）的探头安装夹具。 安装柱包括在一侧的凹部，用于接收通过DUT中的孔安装的弹簧线夹。 外壳包括突起，其接收用于将探针头固定到DUT上的安装柱的螺钉。 螺钉具有接合突起的第一肩部和接合安装柱的第二肩部。 探针头定位在安装柱之间，并使用螺丝拧紧到DUT。 第一个肩膀在探针头上施加向下的压力，而第二个肩膀提供一个正向停止，以防止探针头的过度拧紧，这可能会损坏探针头中的探头触点。

    Apparatus and method for low-profile mounting of a multi-conductor coaxial cable launch to an electronic circuit board
    3.
    发明授权
    Apparatus and method for low-profile mounting of a multi-conductor coaxial cable launch to an electronic circuit board 失效
    一种用于将多导体同轴电缆发射器低调安装到电子电路板的装置和方法

    公开(公告)号：US06857898B2

    公开(公告)日：2005-02-22

    申请号：US10627100

    申请日：2003-07-24

    Applicant: David T. Engquist ,  J. Steve Lyford ,  Devin Bingham

    Inventor： David T. Engquist ,  J. Steve Lyford ,  Devin Bingham

    IPC: H01R9/05 ,  H01R12/24 ,  H05K3/34

    CPC classification number: H05K3/3405 ,  H01R9/0515 ,  H01R12/598 ,  H01R12/7052 ,  H01R12/79 ,  H05K2201/09036 ,  H05K2201/09481 ,  H05K2201/09809 ,  H05K2201/10356

    Abstract: Method and apparatus for launching a coaxial cable onto a circuit board is described. In an example, a circuit board includes a front edge and a major surface. The major surface includes a recessed portion open to the front edge, the recessed portion being defined by a stop surface, opposing side surfaces, and a bottom surface. A plurality of conductive pads is disposed on the major surface. A conductive layer is disposed on at least a portion of the bottom surface. The recessed portion is adapted to receive a multiple conductor ribbon cable to provide thereby low-profile communication of the multiple conductor ribbon cable and the circuit board. The multiple conductor ribbon cable having a plurality of first conductors and a plurality of second conductors respectively associated with the plurality of first conductors. The plurality of conductive pads are adapted to receive respective first conductors of the multiple conductor ribbon cable. The conductive layer is adapted to receive respective second conductors of the multiple conductor ribbon cable.

    Abstract translation: 描述了将同轴电缆发射到电路板上的方法和装置。 在一个示例中，电路板包括前边缘和主表面。 主表面包括一个向前边缘开口的凹入部分，该凹陷部分由止动表面，相对的侧表面和底面限定。 多个导电垫设置在主表面上。 导电层设置在底表面的至少一部分上。 凹部适于接收多导体带状电缆，从而提供多导体带状电缆和电路板的低调通信。 所述多导体带状电缆具有分别与所述多个第一导体分别相关联的多个第一导体和多个第二导体。 多个导电焊盘适于接收多导体带状电缆的相应的第一导体。 导电层适于接收多导体带状电缆的相应的第二导体。

    Self-retaining via probe
    4.
    发明授权
    Self-retaining via probe 有权
    通过探头自保持

    公开(公告)号：US09007083B2

    公开(公告)日：2015-04-14

    申请号：US13197662

    申请日：2011-08-03

    Applicant: David T. Engquist ,  Brian S. Mantel

    Inventor： David T. Engquist ,  Brian S. Mantel

    IPC: G01R1/067

    CPC classification number: G01R1/06733 ,  G01R1/06788

    Abstract: A planar body is configured such that its edges engage the sidewall of a via of a device under test to create point electrical contacts and the planar body resists removal of the planar body from the via after insertion. The edges of the planar body may include barbs that create point electrical contacts and resist removal of the planar body from the via after insertion. The end of the body that is inserted into the via may form a tapered tip to facilitate insertion. The end of the planar body that is inserted into the via may include barbs that resist removal of the planar body from the via after insertion. The edges of the planar body may include stops that prevent further insertion of the planar body into the via beyond the stops.

    Abstract translation: 平面体被构造成使得其边缘接合待测器件的通路的侧壁，以产生点电触点，并且平面主体抵抗插入之后平面体从通孔的移除。 平面主体的边缘可以包括产生点电触点并且在插入之后阻止平面体从通孔去除的倒钩。 插入通孔的主体的端部可以形成锥形尖端以便于插入。 插入通孔的平面体的端部可以包括在插入之后阻止平面体从通孔去除的倒钩。 平面主体的边缘可以包括防止平面体进一步插入超过止挡件的通孔中的挡块。

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