Invention Grant
US08622783B2 Method and system for controlling chemical mechanical polishing by controllably moving a slurry outlet
有权
通过可控地移动浆料出口来控制化学机械抛光的方法和系统
- Patent Title: Method and system for controlling chemical mechanical polishing by controllably moving a slurry outlet
- Patent Title (中): 通过可控地移动浆料出口来控制化学机械抛光的方法和系统
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Application No.: US13157447Application Date: 2011-06-10
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Publication No.: US08622783B2Publication Date: 2014-01-07
- Inventor: Axel Kiesel , Uwe Stoeckgen , John Lampett , Heiko Wundram
- Applicant: Axel Kiesel , Uwe Stoeckgen , John Lampett , Heiko Wundram
- Applicant Address: US TX Austin
- Assignee: Advanced Micro Devices, Inc.
- Current Assignee: Advanced Micro Devices, Inc.
- Current Assignee Address: US TX Austin
- Agency: Williams, Morgan & Amerson, P.C.
- Priority: DE102006056623 20061130
- Main IPC: B24B1/00
- IPC: B24B1/00 ; B24B49/00 ; B24B51/00
Abstract:
A system and a method of operating a chemical mechanical polishing (CMP) system comprises a slurry delivering unit configured for locally varying the supply of slurry while polishing the substrate. To this end, the slurry delivering unit may comprise at least one slurry outlet over a polishing pad of the CMP system, wherein the at least one slurry outlet is controllably movable to distribute slurry over the polishing pad.
Public/Granted literature
- US20110237161A1 METHOD AND SYSTEM FOR CONTROLLING CHEMICAL MECHANICAL POLISHING BY CONTROLLABLY MOVING A SLURRY OUTLET Public/Granted day:2011-09-29
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