Invention Grant
US08624295B2 SRAM devices utilizing strained-channel transistors and methods of manufacture
有权
使用应变通道晶体管的SRAM器件和制造方法
- Patent Title: SRAM devices utilizing strained-channel transistors and methods of manufacture
- Patent Title (中): 使用应变通道晶体管的SRAM器件和制造方法
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Application No.: US12052389Application Date: 2008-03-20
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Publication No.: US08624295B2Publication Date: 2014-01-07
- Inventor: Harry Chuang , Hung-Chih Tsai , Kong-Beng Thei , Mong-Song Liang
- Applicant: Harry Chuang , Hung-Chih Tsai , Kong-Beng Thei , Mong-Song Liang
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L21/762 ; H01L27/092

Abstract:
A novel SRAM memory cell structure and method of making the same are provided. The SRAM memory cell structure comprises strained PMOS transistors formed in a semiconductor substrate. The PMOS transistors comprise epitaxial grown source/drain regions that result in significant PMOS transistor drive current increase. An insulation layer is formed atop an STI that is used to electrically isolate adjacent PMOS transistors. The insulation layer is substantially elevated from the semiconductor substrate surface. The elevated insulation layer facilitates the formation of desirable thick epitaxial source/drain regions, and prevents the bridging between adjacent epitaxial layers due to the epitaxial layer lateral extension during the process of growing epitaxial sour/drain regions. The processing steps of forming the elevated insulation layer are compatible with a conventional CMOS process flow.
Public/Granted literature
- US20090236633A1 SRAM Devices Utilizing Strained-Channel Transistors and Methods of Manufacture Public/Granted day:2009-09-24
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