Invention Grant
US08624369B2 Balance filter packaging chip having balun mounted therein and manufacturing method thereof
有权
具有平衡 - 不平衡转换器的平衡过滤器包装芯片及其制造方法
- Patent Title: Balance filter packaging chip having balun mounted therein and manufacturing method thereof
- Patent Title (中): 具有平衡 - 不平衡转换器的平衡过滤器包装芯片及其制造方法
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Application No.: US11844084Application Date: 2007-08-23
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Publication No.: US08624369B2Publication Date: 2014-01-07
- Inventor: Kuang-woo Nam , Yun-kwon Park , In-sang Song , Jea-shik Shin , Seok-mo Chang , Seok-chul Yun
- Applicant: Kuang-woo Nam , Yun-kwon Park , In-sang Song , Jea-shik Shin , Seok-mo Chang , Seok-chul Yun
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2005-0069379 20050729
- Main IPC: H01L23/02
- IPC: H01L23/02
Abstract:
A balance filter packaging chip having a balun mounted therein and a manufacturing method thereof are provided. The balance filter packaging chip includes a device substrate; a balance filter mounted on the device substrate; a bonding layer stacked on a certain area of the device substrate; a packaging substrate having a cavity formed over the balance filter, and combined with the device substrate by the bonding layer; a balun located on a certain area over the packaging substrate; and an insulator layer for passivating the balun. Accordingly, the present invention can reduce an element size and simplify a manufacturing process.
Public/Granted literature
- US20070285908A1 BALANCE FILTER PACKAGING CHIP HAVING BALUN MOUNTED THEREIN AND MANUFACTURING METHOD THEREOF Public/Granted day:2007-12-13
Information query
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