Invention Grant
- Patent Title: Semiconductor circuit structure
- Patent Title (中): 半导体电路结构
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Application No.: US12547521Application Date: 2009-08-26
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Publication No.: US08624398B2Publication Date: 2014-01-07
- Inventor: Chia-Chen Sun , Shih-Chieh Hsu , Yi-Chung Sheng , Sheng-Yuan Hsueh , Yao-Chang Wang
- Applicant: Chia-Chen Sun , Shih-Chieh Hsu , Yi-Chung Sheng , Sheng-Yuan Hsueh , Yao-Chang Wang
- Applicant Address: TW Hsinchu
- Assignee: United Microelectronics Corp.
- Current Assignee: United Microelectronics Corp.
- Current Assignee Address: TW Hsinchu
- Agency: WPAT, PC
- Agent Justin King
- Main IPC: H01L23/52
- IPC: H01L23/52

Abstract:
A semiconductor circuit structure includes a substrate and an interconnect structure. The interconnect structure is disposed on the substrate and includes a plurality of circuit patterns and at least one closed loop pattern. The closed loop pattern is in a same layer with the circuit patterns, surrounds between the circuit patterns and is insulated from the circuit patterns. The closed loop pattern can protect the circuit patterns from being damaged by stresses, for improving a mechanical strength of the semiconductor circuit structure.
Public/Granted literature
- US20110049722A1 Semiconductor Circuit Structure and Layout Method thereof Public/Granted day:2011-03-03
Information query
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