A wafer edge exposure module connected to a semiconductor wafer track system. The wafer edge exposure module includes a wafer spin device, an optical system, a scanner interface module, and a controller. The wafer spin device supports a wafer for processing. The optical system directs exposure light on a respective edge portion of the wafer simultaneously to create a dummy track on the edge of the wafer. The scanner interface module sends and/or receives dummy edge exposure information from a scanner via a computer network. The controller receives the dummy edge exposure information from the scanner interface module and uses the exposure information to control the optical system.