Invention Grant
US08633112B2 Thermal anneal of block copolymer films with top interface constrained to wet both blocks with equal preference
有权
具有顶部界面的嵌段共聚物膜的热退火被限制以同样优选地湿两个嵌段
- Patent Title: Thermal anneal of block copolymer films with top interface constrained to wet both blocks with equal preference
- Patent Title (中): 具有顶部界面的嵌段共聚物膜的热退火被限制以同样优选地湿两个嵌段
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Application No.: US13469697Application Date: 2012-05-11
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Publication No.: US08633112B2Publication Date: 2014-01-21
- Inventor: Dan B. Millward , Timothy Quick
- Applicant: Dan B. Millward , Timothy Quick
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: TraskBritt
- Main IPC: H01L21/311
- IPC: H01L21/311
Abstract:
Methods for fabricating sub-lithographic, nanoscale microstructures utilizing self-assembling block copolymers, and films and devices formed from these methods are provided.
Public/Granted literature
Information query
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