Invention Grant
US08638116B2 Probe card having configurable structure for exchanging or swapping electronic components for impedance matching and impedance matching method therefore
有权
因此,具有用于交换或交换用于阻抗匹配和阻抗匹配方法的电子部件的可配置结构的探针卡
- Patent Title: Probe card having configurable structure for exchanging or swapping electronic components for impedance matching and impedance matching method therefore
- Patent Title (中): 因此,具有用于交换或交换用于阻抗匹配和阻抗匹配方法的电子部件的可配置结构的探针卡
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Application No.: US13044564Application Date: 2011-03-10
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Publication No.: US08638116B2Publication Date: 2014-01-28
- Inventor: Chao-Ching Huang , Chih-Hao Ho , Wei-Cheng Ku
- Applicant: Chao-Ching Huang , Chih-Hao Ho , Wei-Cheng Ku
- Applicant Address: TW Chu-Pei, Hsinchu Hsiang
- Assignee: MPI Corporation
- Current Assignee: MPI Corporation
- Current Assignee Address: TW Chu-Pei, Hsinchu Hsiang
- Agent Ding Yu Tan
- Priority: TW99107158A 20100311
- Main IPC: G01R31/00
- IPC: G01R31/00

Abstract:
A probe card having a configurable structure for exchanging/swapping electronic components for impedance matching and an impedance method therefore are provided. In the probe card, an applied force is exerted on the electronic component so as to make the electronic component electrically connected with at least one conductive contact pad of a supporting unit. The supporting unit is a circuit board or a space transformer. In order to facilitate the exchange or swap of the electronic component, the applied force can be removed. The probe card includes a pressing plate which can be moved between a pressing position and a non-pressing position. The pressing plate has a pressing surface which is contacted with the top end of the electronic component while the pressing plate is in the pressing position. Therefore, the applied force can be generated or removed by changing the positioning of the pressing plate.
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