Invention Grant
US08642136B2 Substrate processing method and substrate processing apparatus for performing a deposition process and calculating a termination time of the deposition process 有权
基板处理方法和基板处理装置,用于执行沉积处理并计算沉积工艺的终止时间

Substrate processing method and substrate processing apparatus for performing a deposition process and calculating a termination time of the deposition process
Abstract:
A substrate processing method includes performing a deposition process of depositing a thin film on the substrate while depressurizing the inside of the processing chamber and introducing the gas thereinto; and, while the deposition process is being performed, irradiating light, which is transmitted through a monitoring window installed at the processing chamber, toward the inside of the processing chamber through the monitoring window, and monitoring a reflection light intensity of reflection light by receiving the reflection light through the monitoring window. The substrate processing method further includes measuring a temporal variation in the reflection light intensity during the deposition process and calculating a termination time of the deposition process based on a measurement value of the temporal variation; and terminating the deposition process by setting the termination time as an end point of the deposition process.
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