Invention Grant
- Patent Title: Integrated circuit module and manufacturing methods and application thereof
- Patent Title (中): 集成电路模块及其制造方法及应用
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Application No.: US13174832Application Date: 2011-07-01
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Publication No.: US08650520B2Publication Date: 2014-02-11
- Inventor: Shu-Yi Yang , Chen-Hsien Hsu , Jinn-Shyan Wang
- Applicant: Shu-Yi Yang , Chen-Hsien Hsu , Jinn-Shyan Wang
- Applicant Address: TW Hsinchu
- Assignee: United Microelectronics Corp.
- Current Assignee: United Microelectronics Corp.
- Current Assignee Address: TW Hsinchu
- Agent Ding Yu Tan
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
An exemplary integrated circuit module includes a first transistor and a second transistor. The first transistor has a first channel length and a first threshold voltage. The second transistor is electrically coupled to the first transistor and has a second channel length and a second threshold voltage. The second channel length is greater than the first channel length, the absolute value of the second threshold voltage is smaller than the absolute value of the first threshold voltage, and the first transistor and the second transistor have a same threshold voltage implant concentration. Moreover, a manufacturing method of such integrated circuit module, and an application of such integrated circuit module to computer aided design of logic circuit also are provided.
Public/Granted literature
- US20130007678A1 INTEGRATED CIRCUIT MODULE AND MANUFACTURING METHODS AND APPLICATION THEREOF Public/Granted day:2013-01-03
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