Invention Grant
US08665057B2 Electronic assembly having stressable contact bridge with fuse function
有权
电子组件具有带保险丝功能的可压接触桥
- Patent Title: Electronic assembly having stressable contact bridge with fuse function
- Patent Title (中): 电子组件具有带保险丝功能的可压接触桥
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Application No.: US12899941Application Date: 2010-10-07
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Publication No.: US08665057B2Publication Date: 2014-03-04
- Inventor: Roberto Schlenker , Michael Nagel , Juergen Martin
- Applicant: Roberto Schlenker , Michael Nagel , Juergen Martin
- Applicant Address: DE Nuremberg
- Assignee: Conti Temic microelectronic GmbH
- Current Assignee: Conti Temic microelectronic GmbH
- Current Assignee Address: DE Nuremberg
- Agent W. F. Fasse
- Priority: DE102005014601 20050331
- Main IPC: H01H85/36
- IPC: H01H85/36 ; H01H37/76

Abstract:
An electronic circuit includes a conductor path on a circuit board, and at least one SMD component, electronic component and/or electromechanical component mounted on the circuit board and connected to the conductor path. A circuit connection is established via a soldered joint and a spring-loaded or stressed springy contact bridge that provides fuse protection. In the event of excessive power dissipation or high temperature, the soldered joint melts or softens and the contact bridge springs open to interrupt the circuit.
Public/Granted literature
- US20110050386A1 Electronic Assembly Having Stressable Contact Bridge with Fuse Function Public/Granted day:2011-03-03
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