Invention Grant
- Patent Title: Lateral semiconductor device and manufacturing method therefor
- Patent Title (中): 侧面半导体器件及其制造方法
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Application No.: US13560109Application Date: 2012-07-27
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Publication No.: US08686505B2Publication Date: 2014-04-01
- Inventor: Marc Strasser , Karl-Heinz Gebhardt , Ralf Rudolf , Lincoln O'Riain
- Applicant: Marc Strasser , Karl-Heinz Gebhardt , Ralf Rudolf , Lincoln O'Riain
- Applicant Address: DE Dresden
- Assignee: Infineon Technologies Dresden GmbH
- Current Assignee: Infineon Technologies Dresden GmbH
- Current Assignee Address: DE Dresden
- Agency: Murphy, Bilak & Homiller, PLLC
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L29/78 ; H01L21/301 ; H01L21/335

Abstract:
A method produces a semiconductor device including a semiconductor body, an electrode thereon, and an insulating structure insulating the electrode from the semiconductor body. The semiconductor body includes a first contact region of a first conductivity type, a body region of a second conductivity type, a drift region of the first conductivity type, and a second contact region having a higher maximum doping concentration than the drift region. The insulating structure includes a gate dielectric portion forming a first horizontal interface. with the drift region and has a first maximum vertical extension A field dielectric portion forms with the drift region second and third horizontal interfaces arranged below the main surface. A second maximum vertical extension of the field dielectric portion is larger than the first maximum vertical extension. A third maximum vertical extension of the field dielectric portion is larger than the second maximum vertical extension.
Public/Granted literature
- US20140027848A1 Lateral Semiconductor Device and Manufacturing Method Therefor Public/Granted day:2014-01-30
Information query
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