Invention Grant
- Patent Title: Method of fabricating substrate where patterns are formed
- Patent Title (中): 制造图案的基板的制造方法
-
Application No.: US13265348Application Date: 2009-04-24
-
Publication No.: US08691334B2Publication Date: 2014-04-08
- Inventor: Euijoon Yoon , Sung-Hoon Kwon
- Applicant: Euijoon Yoon , Sung-Hoon Kwon
- Applicant Address: KR Gyeonggi-do
- Assignee: SK Hynix Inc.
- Current Assignee: SK Hynix Inc.
- Current Assignee Address: KR Gyeonggi-do
- Agency: William Park & Associates Patent Ltd.
- International Application: PCT/KR2009/002154 WO 20090424
- International Announcement: WO2010/123165 WO 20101028
- Main IPC: B05D1/12
- IPC: B05D1/12 ; B05D1/36 ; B05D5/06

Abstract:
Provided is a method of fabricating a substrate where patterns are formed, the method including: forming first bonding agent patterns having selective cohesion in a position in which oxide bead patterns are to be formed on a substrate; coating a second bonding agent having larger cohesion with the first bonding agent than cohesion with the substrate, on a plurality of oxide beads, applying the oxide beads, on which the second bonding agent is coated, to the substrate and forming the oxide beads, on which the second bonding agent is coated, on the first bonding agent patterns; and thermally processing the substrate.
Public/Granted literature
- US20120040092A1 METHOD OF FABRICATING SUBSTRATE WHERE PATTERNS ARE FORMED Public/Granted day:2012-02-16
Information query